| Allicdata Part #: | ATS6270-ND |
| Manufacturer Part#: |
ATS-03C-150-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-150-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management products come in all shapes and sizes, from tiny USB or computer fans to massive industrial air conditioners. One product that can often be seen in a wide variety of applications is the ATS-03C-150-C2-R0 heat sink. This type of heat sink is designed to effectively transfer heat away from a hot component or assembly.
The ATS-03C-150-C2-R0 heat sink is a copper-based product which utilizes a uniquely designed fin array, light weight design and efficient thermal performance. The cylindrical shape increases surface area heat dissipation, while also minimizing space requirements. Its design features an integrated copper base, built-in rolled fins and a variety of options, allowing it to accommodate tight spaces and areas with limited airflow.
The ATS-03C-150-C2-R0 heat sink is primarily used in a wide range of applications requiring a small, compact, and lightweight thermal management solution. These can include hot spot enclosure cooling, consumer electronics, low noise computer cooling, power electronics, and more.
The working principle of the ATS-03C-150-C2-R0 heat sink is quite simple. Heat is generated by an electronic component and transferred to the copper base of the sink. The heat is then dissipated through the integrated fins, which are specially designed to efficiently transfer heat away from the component. The fins also serve to decrease the temperature of the surrounding air, helping to boost cooling performance.
The ATS-03C-150-C2-R0 heat sink is a highly efficient thermal management solution that can be used in a wide variety of applications. Its lightweight design, easy-to-install mounting system, low cost and impressive efficiency make it a popular choice among consumers and businesses alike. With effective heat transfer capabilities, this heat sink can help to ensure that electronic components stay cool and continue to operate efficiently.
The specific data is subject to PDF, and the above content is for reference