| Allicdata Part #: | ATS-03C-152-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-152-C1-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-152-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47130 |
| 30 +: | $ 3.37743 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03C-152-C1-R0 is a thermal heat sink designed for optimized cooling performance. It is made of aluminum and is designed to provide the highest possible cooling capacity. The advanced, low-profile design allows the ATS-03C-152-C1-R0 to fit into tight spaces, making it an excellent choice for thermal management in tight spaces. The ATS-03C-152-C1-R0 can be used in all types of cooling applications and is ideal for heat dissipation in high performance computing, data centers, and other areas that require effective thermal management.
The ATS-03C-152-C1-R0 is designed to dissipate heat by drawing heat away from a component and dissipating it into the atmosphere. Its design helps to efficiently capture and distribute the heat away from the source. The device itself is lightweight and the base can be adjusted to fit in tight spaces. The ATS-03C-152-C1-R0 also comes with two fan housings and a variety of mounting options. This makes the device easy to install and maintain.
The ATS-03C-152-C1-R0 works by taking advantage of the convection process. As heat is generated in the device, it is transferred into the air. As hot air rises, it is drawn away from the heat source and into the ATS-03C-152-C1-R0 cooling device. The fan in the device uses its blades to draw the hot air away from the component being cooled and move it toward the vents of the device. The air is then drawn out of the device by the fan, allowing the device to cool the component effectively and efficiently.
The ATS-03C-152-C1-R0 thermal heat sink is a great solution for those needing effective, efficient cooling in tight spaces. Its advanced, low-profile design allows it to fit in even the tightest spaces. The device\'s lightweight construction and adjustable base make it easy to install and maintain. The two fan housings and a variety of mounting options make the ATS-03C-152-C1-R0 a great choice for thermal management in a variety of applications. The device\'s convection design makes it capable of dissipating large amounts of heat, making it an ideal choice for heat dissipation in high performance computing and data center applications.
The specific data is subject to PDF, and the above content is for reference