| Allicdata Part #: | ATS-03C-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical to the proper operation of many electronic systems in order to ensure long-term reliability. Heat sinks have been used for many years to dissipate the heat created by components in electronic systems. The ATS-03C-153-C1-R0 heat sink is a reliable and cost-effective solution for managing heat dissipation in a variety of applications.
Overview
The ATS-03C-153-C1-R0 heat sink is a low-profile, heat-dissipating component designed for use in a variety of applications. The heat sink is made from anodized aluminum and features a unique finned design that increases its surface area and allows it to dissipate more heat than other heat sinks of its kind. The heat sink also features a square base that allows it to be mounted securely in a variety of mounting configurations. The heat sink is rated for temperatures up to 150°C and can be used in either horizontal or vertical applications, making it a versatile solution for various applications.
Application Field
The ATS-03C-153-C1-R0 heat sink can be used in a variety of applications, such as:
- Computer systems
- Communication systems
- Power supplies
- Industrial automation systems
- Telecommunications systems
- Laser components
The heat sink can be used to manage heat dissipation in the above applications, especially in those that involve high-heat components such as lasers, which require efficient cooling to ensure reliable performance. In addition, the heat sink is lightweight and compact, making it ideal for applications where space is at a premium.
Working Principle
When the heat sink is mounted in the proper orientation, heat generated by components in the system dissipates into the fins of the heat sink. The fin design creates a large surface area that increases the amount of air that can be circulated over the fins and around the components, allowing for more efficient heat transfer between the component and the heat sink. The heat is then dissipated into the air, keeping the overall temperature of the system within safe levels.
The heat sink also features a square base that allows for secure mounting to the system. The square base also helps to maintain a consistent airflow pattern over the fins and components to ensure optimal performance.
Conclusion
The ATS-03C-153-C1-R0 is a reliable and cost-effective thermal management solution for a variety of applications. Its low-profile, finned design increases surface area and allows for efficient heat transfer between components and the environment. In addition, the heat sink features a square base that allows for secure mounting in a variety of configurations. This makes the ATS-03C-153-C1-R0 a versatile thermal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference