| Allicdata Part #: | ATS-03C-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-16-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in modern electronic systems, and a variety of cooling options are used to ensure that temperatures remain within safe operating ranges. One common cooling solution is the use of heat sinks, which transfer heat away from the components. The ATS-03C-16-C1-R0 heat sink is an advanced thermal solution designed for the cooling needs of small electronic devices.
The ATS-03C-16-C1-R0 heat sink is a compact and lightweight aluminum heat sink with a pin fin pattern. The product is designed to optimize cooling performance, thanks to its fin design, which maximizes surface area for increased heat dissipation. Additionally, the heat sink is equipped with a thermal transfer pad on the bottom to further reduce temperatures by dissipating heat into the surrounding environment.
The heat sink has a thermal resistance of 0.3°C/W, which makes it suitable for cooling small components such as microprocessors and circuit boards, as well as low-power applications such as portable electronics. Additionally, the pin fin pattern helps to reduce laminar air flow, leading to improved cooling and enhanced performance. In addition, the thermal transfer pad helps to ensure that the heat sink is effective even in confined and cramped spaces.
The ATS-03C-16-C1-R0 heat sink is the ideal cooling solution for a variety of small devices and applications that require efficient and reliable thermal management. The product is small enough to fit into the tightest spaces and its advanced fin pattern allows for maximum heat dissipation. Additionally, the thermal transfer pad helps to reduce temperatures even further, making the ATS-03C-16-C1-R0 heat sink a reliable and cost-effective solution for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference