| Allicdata Part #: | ATS-03C-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management components play a key role in overheating problems due to their effectiveness in heat dissipation. ATS-03C-170-C3-R0 is an important component used for developing ideal thermal solutions and is widely used as a radiator, heat sink and conductor in modern electronic systems. This article discusses the application fields and working principles of ATS-03C-170-C3-R0.
One of the most noticeable advantages of the ATS-03C-170-C3-R0 is its maximum heat dissipating capacity, which can reach up to 175 W/mK in normal environment. At the same time, its size is relatively small compared to other similar thermal solutions, which makes it more suitable for various kinds of applications. It is capable of furthering the stability and reliability of the system, keeping its temperature at an optimal level.
ATS-03C-170-C3-R0 is widely used in the various fields, such as communication equipments, industrial control system, home appliance, consumer electronics, automotive electronics, and other thermal management components. In simple terms, it can be used in the almost all circumstances when thermal management is necessary.
TS-03C-170-C3-R0 has a dual-layer construction. It is made up of a thermal condenser and a heat sink. The former part is made of heat transfer and conductive materials such as aluminum and copper. In addition, special thermal adhesive or TIM (thermal interface material) is used between the two layers to enhance heat transfer and thermal conduction.
The working principle of ATS-03C-170-C3-R0 can be divided into two parts, thermal conduction and radiating mode, both of which are responsible for the thermal management of the system. On the one hand, thermal conduction works by transferring heat from the heat source to the heat sink; on the other hand, heat radiating mode helps to release the heat to the outside environment.
When applied to a typical electronic system, ATS-03C-170-C3-R0 transfers the heat from the heat source by means of thermal conduction. Then, the heat gets transferred to the heat sink, which dissipates the heat to the atmosphere through radiation. The air flow generated by the fans also plays an important role in the dissipation of the heat from the system.
Thermal management is an important field when it comes to optimal system performance and reliability. ATS-03C-170-C3-R0 has proven to be an exceptional thermal solution in this respect. Its small size and high heat-dissipating capacity makes it a perfect choice for variety of applications, particularly on electronic systems.
The specific data is subject to PDF, and the above content is for reference