| Allicdata Part #: | ATS-03C-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to move heat away from a hot surface, typically either by convection or conduction. These devices are usually made of metal and can be simple, as in the case of air-cooled heat sinks, or more complex, when liquid- or gas-cooled systems are used. Heat sinks are widely used in electronics to help dissipate heat from integrated circuits, microprocessors, memory modules, and other electronic components.
The ATS-03C-20-C1-R0 is a type of heat sink designed for thermal applications. It is a cost-effective solution that combines both power and thermal control. This thermal solution provides highly efficient heat dissipation, increased lifespan for components, and reduced downtime in high-load applications. In addition, it is designed with a low profile and is easy to mount and install.
The ATS-03C-20-C1-R0 heat sink is designed to be used in a wide range of applications, such as smartphones, computers, automotive, and industrial products. It is also suitable for more specific applications, like cameras, as it is design to reduce the risk of overheating due to its excellent thermal performance. The ATS-03C-20-C1-R0 is the perfect choice for applications that require efficient heat dissipation but also require a small form factor.
The ATS-03C-20-C1-R0 heat sink works by moving heat away from the hot surface by convection and conduction. The heat sink has an aluminum fin stack which acts as a heatsink base. Heat from the hot surface is transferred to the aluminum fins, which act as a heat spreading surface. The heat then flows through the fins, moving away from the hot surface. The fins are then cooled by ambient air, either by natural convection or forced convection. This helps dissipate heat away from the hot surface, allowing components in the system to operate at lower temperatures.
In addition, the ATS-03C-20-C1-R0 heat sink is designed with an adjus table thermal management system, which allows users to adjust the airflow, temperature, and noise levels. This feature allows users to customize the heat sink to their exact needs and requirements. The heat sink also features a fan speed control, which helps provide a steady airflow to ensure efficient cooling.
Overall, the ATS-03C-20-C1-R0 heat sink is an ideal solution for a wide range of applications that require efficient heat dissipation. It is a cost-effective and highly efficient heat sink that is designed with advanced features, such as adjustable thermal management, fan speed control, and excellent thermal performance. As such, it is an ideal choice for any application that requires the best thermal performance and reduced downtime.
The specific data is subject to PDF, and the above content is for reference