| Allicdata Part #: | ATS-03C-203-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-203-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-203-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are an efficient device for cooling electronic components and systems. The ATS-03C-203-C1-R0 is a thermal heat sink used to dissipate heat from PCB-mounted devices. The ATS-03C-203-C1-R0 heat sink is designed to provide sufficient and consistent cooling to the devices mounted onto a printed circuit board.
Application Field
The application field of the ATS-03C-203-C1-R0 heat sink is generally within the electronic and electrical industry. As this heat sink is designed to be mounted onto a printed circuit board, it is used mainly for cooling the devices attached to the board, such as integrated circuits, transistors, memory modules, and other electronic components. It can also be used for cooling LED bulbs and power modules, ensuring that they work under optimal temperature conditions.
Working Principle
The ATS-03C-203-C1-R0 heat sink works by dissipating and transferring heat from the electronic components on the printed circuit board to the surrounding environment. The basic principle behind the working of the heat sink is known as convection. Through the use of a thin aluminum or copper heat-dissipating plate, the thermal energy from the electronic components is transferred to the atmosphere by natural convection or forced convection, depending on the environment. The heat plate may be augmented with multiple cooling fins to provide greater surface area for heat dissipation. The heat is transferred through the heat plate to the cooling fins, then to the atmosphere.
The heat plate of the ATS-03C-203-C1-R0 heat sink is designed with optimized fins to ensure efficient heat dissipation and transfer. The cooling plate surface is made up of a high performance alloy coating, which further enhances the performance of the heat sink and also provides corrosion resistance. In addition, the ATS-03C-203-C1-R0 heat sink is designed to ensure low thermal resistance and transfer, allowing optimal heat dissipation from the electronic components while ensuring lower operating temperatures. This is further achieved by the use of a thermal adhesive pad between the heat sink and the electronic component, ensuring that the heat is transferred quickly and efficiently.
The ATS-03C-203-C1-R0 heat sink is an efficient device for cooling electronic components and systems. Its application field is mainly within the electronics and electrical industry. The device works on the principle of convection, transferring thermal energy from the components to the atmosphere, and is designed with an enhanced heat dissipating plate and cooling fins for efficient heat transfer. The device also features a thermal adhesive pad between the heat sink and device to ensure low thermal resistance and optimal heat dissipation. Thus, the ATS-03C-203-C1-R0 heat sink provides efficient and consistent cooling to electronic components mounted on a printed circuit board.
The specific data is subject to PDF, and the above content is for reference