| Allicdata Part #: | ATS-03C-27-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-27-C3-R0 |
| Price: | $ 7.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-27-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.51231 |
| 30 +: | $ 6.15027 |
| 50 +: | $ 5.78857 |
| 100 +: | $ 5.42676 |
| 250 +: | $ 5.06498 |
| 500 +: | $ 4.70319 |
| 1000 +: | $ 4.61275 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
In the world of electronics, heat is an ever-present concern. Thermal management is key to an efficient and well performing system, and heat sinks are essential for efficient thermal management. Heat sinks are used to dissipate heat delocalized from electronic components and are critical for maintaining optimal temperatures in any system. It is important to select the right heat sink to match the specific application needs, and the ATS-03C-27-C3-R0 heat sink is an excellent choice in many applications.
The ATS-03C-27-C3-R0 is a high-performance heat sink designed for use in a wide variety of applications. It is a fanless heat sink with an aluminum fin, and measures in at 27 mm x 27 mm x 16.5 mm. This makes it a great choice for smaller applications that require a compact heat sink. The ATS-03C-27-C3-R0 has a maximum power dissipation of 2.8 W, which makes it suitable for applications that have lighter thermal loads.
The heat sink features three slotted fins, which allows air to flow more freely without creating noise or airflow disruption. This also helps to improve the efficiency of the heat sink. The ATS-03C-27-C3-R0 is designed to work with CPUs of up to 2 GHz, making it well-suited for applications with medium loads. Additionally, it has a die-cast aluminum base, which increases the heat conducting capability of the heat sink.
The ATS-03C-27-C3-R0 operates on a natural convection physical cooling mechanism, meaning that the heat sink takes advantage of the natural air flow in the environment to dissipate heat. This mechanism is simpler in design, and requires no moving parts, making it more reliable and cost effective than more complex forced convection designs. Additionally, it helps to reduce the total power consumption of the system.
The ATS-03C-27-C3-R0 is fully compatible with standard computing components, such as Intel chipsets, AMD chipsets and SBCs (single-board computers). It is compliant with REACH and RoHS standards, and is backed by a five-year warranty. The ATS-03C-27-C3-R0 is an excellent choice for applications requiring efficient and reliable cooling performance.
In summary, the ATS-03C-27-C3-R0 is an ideal heat sink option for applications requiring a smaller, fanless solution. Its compact dimensions and maximum power dissipation of 2.8 W make it suitable for applications with lighter thermal loads. Additionally, its natural convection physical cooling mechanism provides reliable cooling performance, while helping to reduce the total power consumption of a system. This makes the ATS-03C-27-C3-R0 a great choice for applications needing efficient and reliable thermal management.
The specific data is subject to PDF, and the above content is for reference