| Allicdata Part #: | ATS-03C-30-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-30-C3-R0 |
| Price: | $ 8.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-30-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 7.31934 |
| 30 +: | $ 6.88861 |
| 50 +: | $ 6.45813 |
| 100 +: | $ 6.02759 |
| 250 +: | $ 5.59705 |
| 500 +: | $ 5.48941 |
| 1000 +: | $ 5.38177 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03C-30-C3-R0 is a high-performance thermal - heat sink used in a variety of applications. It is designed to reduce and dissipate heat that is produced by various electronic and electrical components. The thermal - heat sink is capable of providing efficient cooling to components while also offering uniform thermal management.
The ATS-03C-30-C3-R0 is a highly versatile product that can be used in various industries and applications. It is suitable for industrial, telecommunications, automotive, medical, and many more applications. Additionally, it is the perfect solution for high-frequency motion control applications.
The heat sink uses a combination of electrical and physical principles to provide efficient cooling. The thermal - heat sink is composed of several components, including a heatsink base, a finned heatsink, and several heat pipes. The base and finned heatsink both provide a large surface area for heat transfer to occur. The heat pipes then transfer the heat to the surface of the heatsink fin, where it is quickly dissipated.
Heat sinks are also widely used in computers and other electronics to help keep components cool. The ATS-03C-30-C3-R0 is particularly well-suited for this application since it can dissipate heat quickly and consistently. The heat pipes also allow for efficient removal of heat from components like CPUs and GPUs, allowing them to run at peak performance.
Heat pipes are also effective at regulating the temperature of sensitive components within a system. By transferring heat away from sensitive parts, they help to ensure that the system remains stable and reliable.
The ATS-03C-30-C3-R0 is a reliable and efficient thermal - heat sink. It is designed to reduce and dissipate heat produced by various electronic and electrical components. The thermal - heat sink is composed of a base, a finned heatsink, and several heat pipes, which make it an excellent choice for industrial, telecommunications, automotive, medical, and many more applications. Additionally, it is the perfect solution for high-frequency motion control applications due to its efficient heat transfer and removal of heat from sensitive components.
The specific data is subject to PDF, and the above content is for reference