| Allicdata Part #: | ATS-03C-33-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-33-C3-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-33-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are required to keep equipment running safely and efficiently. One of the primary solutions that are often employed to protect and enhance the performance of equipment is a heat sink. The ATS-03C-33-C3-R0 is a specific type of heat sink with a variety of uses and capabilities. In this article we will discuss the application field and corresponding working principle of the ATS-03C-33-C3-R0.
Heat sinks increase the surface area exposure to the air which keeps them cooler by facilitating more efficient heat dissipation to the ambient air. The ATS-03C-33-C3-R0 is a heat sink specifically designed with an aluminum top cover, a copper base, black nickel plating and an integrated fan. The ATS-03C-33-C3-R0 is the perfect choice when trying to maintain lower case temperatures in remote environments or for low power consumption applications. The ATS-03C-33-C3-R0 also provides exceptional thermal performance due to its excellent structural design. This heat sink is a great choice when trying to extend the life of electronic components and is useful in a variety of applications, such as motherboards, graphics cards, power supplies, CPUs and other electronic applications.
The thermal performance of the ATS-03C-33-C3-R0 is enabled by the aluminum top cover, copper base and black nickel plating. Aluminum is a light weight and highly conductive material which means it is able to efficiently dissipate more heat away from the components it is covering. The copper base also helps to dissipate heat while the black nickel plating improves overall thermal performance and widens the heat spread area. The integrated fan also helps to provide adequate airflow to keep the components cool.
The ATS-03C-33-C3-R0 is designed to efficiently cool the components it is assigned to keep cool. The design of the ATS-03C-33-C3-R0 helps to create an even cooling surface that can be applied over an unlimited number of components to be cooled. Through a combination of the aluminum top cover, copper base, black nickel plating and integrated fans, thermal performance of the ATS-03C-33-C3-R0 is enhanced and improved significantly.
The ATS-03C-33-C3-R0 heat sink is an ideal solution for applications that require cooling of components in remote environments or low power consumption applications. Its efficient design ensures that components are maintained at a safe operating temperature and that their performance and longevity are preserved. Through the combination of aluminum top cover, copper base, black nickel plating and integrated fan, the ATS-03C-33-C3-R0 provides maximum efficiency for thermal management and is a great solution when cooling components in a variety of applications.
The specific data is subject to PDF, and the above content is for reference