| Allicdata Part #: | ATS-03C-37-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-37-C3-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-37-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are integral components used in a wide variety of applications to dissipate heat energy in an efficient manner. The ATS-03C-37-C3-R0, is a Passive CPU Heat Sink that utilizes a combination of aluminum fins and copper base to conduct the dissipated heat away from the CPU and into the surrounding atmosphere. It is designed to provide optimal airflow while maintaining a small size, making it suitable for a range of applications.
The ATS-03C-37-C3-R0 is designed for use in computers, as well as other applications that require cooling of electronics. As its name suggests, the heat sink is shaped like an upside-down \'C\' and has an overall height of 37.8mm and length of 74.53mm. To increase heat transfer efficiency, the heat sink is equipped with a copper base and aluminum fins which work together to conduct heat away from the heat source. The aluminum fins absorb the heat from the source and transfer it to the copper base, where it is dissipated away from the device.
The ATS-03C-37-C3-R0 is designed to be installed between the CPU and the motherboard, providing cooling to the processor. This is done by conducting the heat away from the CPU and dissipating it through the aluminum fins. To ensure the heat sink is securely installed, the user should use a thermal pad, thermal paste, or thermal tape to attach the heat sink to the CPU. This allows for contact between the surface of the heat sink and the processor, ensuring maximum transfer of heat.
The ATS-03C-37-C3-R0 is designed to be used with a fan. Using a fan coupled with the heat sink will provide improved cooling performance as it directs the air across the fins for faster heat dissipation. This is especially important in applications where the device needs to operate at high temperature levels due to intense usage or other environmental factors.
In addition, to ensure maximum cooling performance, the ATS-03C-37-C3-R0 features a unique ‘fin stacking’ feature which is designed to facilitate better dissipation. This design stacks the fins in a particular pattern, which decreases the surface area of the fins and increases the speed of heat transfer. This feature is especially beneficial in applications where heat dissipation is critical.
The ATS-03C-37-C3-R0 is designed for low-profile applications and offers an efficient method of cooling for different types of electronic devices. It is made with an aluminum base, copper heat pipes and aluminum fins for maximum heat transfer efficiency. The high heat conductivity of the copper heat pipes, combined with the efficient stacking of the aluminum fins, ensures that heat is quickly and effectively conducted away from the heat source, keeping the device cool and operating at optimal levels.
The specific data is subject to PDF, and the above content is for reference