| Allicdata Part #: | ATS-03C-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-03C-46-C3-R0 is a heat sink that is used to transfer heat generated by a device into a different space or media at a lower temperature to preserve the device from overheating.
Application Field
The ATS-03C-46-C3-R0 heat sink can be used in a wide range of applications ranging from domestic to industrial. It is an ideal choice for thermal management in applications such as computers, electronic equipment, automotive, and medical devices. Its superior cooling capacity makes it suitable for high-performance applications where higher power dissipation is involved. It is also a great choice for power supplies, home theater systems, and other audio/video systems.
Working Principle
The ATS-03C-46-C3-R0 uses a patented phase-change thermal management system to effectively transfer heat away from the device being cooled. This is accomplished by first capturing the heat generated in a resistive thermal past. This material has a high thermal conductivity, so it quickly absorbs the heat and allows it to be rapidly transferred to a nearby heat sink. From there, the heat is dissipated using a combination of air-cooling, convection, and other external methods.
The heat sink itself is designed to effectively dissipate heat, and thus lowers the temperature of the device being cooled. The patented design of the heat sink ensures maximum efficiency, meaning that very little of the heat generated is lost in the process. This means that the device can operate at optimum performance levels without running the risk of overheating.
Conclusion
The ATS-03C-46-C3-R0 is a highly efficient heat sink that is able to effectively manage temperatures in a wide range of applications. It is perfect for high-performance systems, especially those where high power is involved. The patented system ensures that maximum efficiency is achieved, guaranteeing that the device being cooled remains at the optimal temperature.
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