| Allicdata Part #: | ATS6351-ND |
| Manufacturer Part#: |
ATS-03C-48-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-48-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of many electronics applications such as power supplies, motor drivers, data processing, and more. The efficient operation of these applications requires fixed operating temperatures, often with tight thermal ranges and stringent environmental requirements. Heat sinks are essential components used in conjunction with integrated circuits, board-level components, and active ICs to help draw heat away from the device core, thus allowing efficient operation over a wide temperature range. The ATS-03C-48-C2-R0 heat sink is engineered to meet the needs of these electronic applications.
The ATS-03C-48-C2-R0 is a high-performance aluminum heat sink designed for applications that require efficient thermal management. It is designed with a folded fin pattern with a highly efficient thermal transfer design that provides the industry\'s highest rate of heat dissipation. This feature makes the ATS-03C-48-C2-R0 heat sink an ideal thermal management solution for power supplies, motor drivers, power transistors, and other active components.
The ATS-03C-48-C2-R0 utilizes two 6-finned, radial heat sinks that are engineered to operate at optimal efficiency. The fins are arranged in a symmetrical diamond pattern and are separated by a high-capacity heat-conducting material such as copper. The heat generated from the core is then dissipated evenly through the heat sinks to ensure optimal thermal performance. This design allows the ATS-03C-48-C2-R0 to dissipate more heat faster than standard heat sinks and provides superior thermal management performance in power supplies, motor drivers, and other active applications.
The ATS-03C-48-C2-R0 has a wide temperature range of -40 to +90°C, allowing it to perform optimally in most environments. This makes the ATS-03C-48-C2-R0 ideal for applications that require consistent performance in various operating temperatures. The ATS-03C-48-C2-R0 is also fitted with a high-performance thermally conductive material to help maintain low junction temperature and reduce heat buildup. This ensures that the heat sink design retains its efficient thermal performance and tight thermal ranges, even in harsh operating environments.
The ATS-03C-48-C2-R0 heat sink is designed for use in applications that require improved thermal and electrical performance. Its unique design and robust construction make it an excellent choice for applications that require high thermal efficiency, tight thermal ranges, and consistent performance in various environments. With its reliable performance, robust construction, and flexible operating temperatures, the ATS-03C-48-C2-R0 makes an ideal choice for many commercial and industrial applications.
The specific data is subject to PDF, and the above content is for reference