ATS-03C-55-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03C-55-C1-R0-ND

Manufacturer Part#:

ATS-03C-55-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03C-55-C1-R0 datasheetATS-03C-55-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 23.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

ATS-03C-55-C1-R0 Application Field and Working Principle

Heat sinks are an integral component of any thermal management system as they are designed to dissipate heat away from critical components and protect them from damage due to excessive temperatures. The ATS-03C-55-C1-R0 heat sink is one such solution that is designed for use in high-performance applications where a low profile and high-temperature capabilities are critical.

This heatsink is designed to operate over a wide temperature range from -20°C to +85°C. It is constructed out of a high-efficiency aluminum alloy that offers excellent thermal conductivity and excellent structural strength and durability. The fins of the heatsink offer increased surface area for dissipating heat, allowing it to perform more efficiently at higher temperatures. Additionally, the heatsink\'s low-profile design helps to reduce overall system size and cost.

The ATS-03C-55-C1-R0 is designed to be used with fan-assisted thermal management solutions. It has a unique integrated fan mount configurations that allow a single fan to be mounted directly on top of the heatsink while maintaining its low-profile design. The fan mount offers excellent air circulation and can be easily adjusted to provide the optimal cooling performance. The fan mount also includes a vibration-dampening material to reduce fan noise and improve system reliability.

In addition to its efficient heat dissipation capabilities, the ATS-03C-55-C1-R0 also offers excellent electrical isolation properties. It is made from flame retardant (FR-4) materials that offer enhanced protection against electrical shock and fire, improving system safety. Additionally, the material has excellent thermal protection properties that help to prevent component overheating.

The ATS-03C-55-C1-R0 heat sink is an ideal solution for a wide range of applications, including servers, data centers, HVAC systems and industrial control systems. Its low profile design and wide temperature operating range make it an excellent choice for high-performance applications. The fan-assisted cooling system ensures that the heatsink is able to dissipate the heat generated by the components being cooled efficiently and effectively.

The specific data is subject to PDF, and the above content is for reference

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