ATS-03C-60-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03C-60-C1-R0-ND

Manufacturer Part#:

ATS-03C-60-C1-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03C-60-C1-R0 datasheetATS-03C-60-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become an essential part of modern technology as fast-moving hardware components generate more heat. ATS-03C-60-C1-R0 is a state-of-the-art thermal management device that provides innovative cooling solutions for various applications. The device is designed to reduce temperatures up to 60°C (140°F) in a few seconds while consuming very little energy.

The ATS-03C-60-C1-R0 belongs to the thermal-heat sinks category of thermal management devices. It uses the principle of convection cooling to move heat from the object being cooled to an external heat sink. A passive heat sink, also known as a cooling fin, is installed on the device and serves as a conduit for the heat transfer. The heat transfer is accomplished by air passing over the cooling fins, which causes the air to become heated and dissipated outside the device. In addition, the device also uses a fan to aid in the dissipation of the heat, as well as to generate additional airflow necessary for proper cooling.

The ATS-03C-60-C1-R0’s convection-cooling principle is quite effective in dissipating heat and keeping the desired items at a constant temperature. It has been designed to work in a wide range of applications, including electronics, automotive, manufacturing, and IT. For electronics applications, it is capable of cooling items such as CPUs, GPUs, motherboards, and graphics cards. It is also suitable for use in automotive applications, where it is capable of cooling high-temperature components such as spark plugs and fuel injectors.

In manufacturing applications, the device is capable of cooling industrial-grade motors and control units. It can also be employed to cool down IT components such as servers, racks, and other high-density components. The ATS-03C-60-C1-R0 is typically used in combination with other thermal management components such as a fan or forced convection cooling systems to maximize its cooling efficacy.

The ATS-03C-60-C1-R0 is ideal for organizations that are looking to improve the efficiency and longevity of their electronic and industrial equipment. It is a simple, cost-effective, and reliable solution for cooling high-temperature components without the need for additional energy consumption. The device allows for optimal temperatures to be maintained, thereby ensuring the proper functioning of the equipment and its components. In addition, its fan design is capable of both cooling and providing gentle air movement to prevent heat stagnation.

Overall, the ATS-03C-60-C1-R0 is a highly efficient and affordable thermal-heat sink device that can be used in a wide range of applications. It utilizes the principles of convection cooling to transfer heat away from desired items and into an external heat sink. Additionally, its fan-assisted cooling system can further improve the device’s performance and help keep components running at their optimal temperatures.

The specific data is subject to PDF, and the above content is for reference

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