ATS-03C-63-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS6366-ND

Manufacturer Part#:

ATS-03C-63-C2-R0

Price: $ 4.39
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03C-63-C2-R0 datasheetATS-03C-63-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.99420
10 +: $ 3.88647
25 +: $ 3.67063
50 +: $ 3.45467
100 +: $ 3.23870
250 +: $ 3.02279
500 +: $ 2.80687
1000 +: $ 2.75290
Stock 1000Can Ship Immediately
$ 4.39
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction: ATS-03C-63-C2-R0 is a specific type of thermal-heat sink from the ATS family of products, which are designed to maximize the thermal efficiency of electrical and electronic components by dissipating heat rapidly and evenly. Developed by experienced professionals and engineered to provide superior heat dissipation, the ATS-03C-63-C2-R0 is constructed from a variety of materials to guarantee long-term performance.

Application Field: The ATS-03C-63-C2-R0 is ideal for a wide range of electronic and electrical components. Its efficient thermal dissipation prevents the equipment and components from overheating, and its low noise levels make it a great choice for quieter working conditions. It can be used to cool LED lights, CPUs, CPUs and other microprocessors, motor controllers, and other components in large data centers. It is also ideal for Telecommunications, Medical Imaging, I/O circuit boards, and any other applications with a lot of heat dissipating components.

Advantages: The ATS-03C-63-C2-R0 offers several advantages for use in various applications. It is extremely lightweight and has excellent resistance to corrosion and abrasion, making it ideal for sensitive environments. Additionally, its ultra-thin profile allows it to fit into tighter spaces, making it a great choice for projects where space is at a premium. Furthermore, each component of the ATS-03C-63-C2-R0 is constructed with advanced machining techniques to ensure consistent, optimal performance.

Working Principle: The working principle of the ATS-03C-63-C2-R0 is simple but effective. Heat is expelled from an electrical or electronic component through the use of thermally-conductive heat sink fins. These fins provide a large surface area for heat dissipation, while the aluminum or copper construction acts as an efficient dissipative medium. The design prevents heat from accumulating and reduces the thermal delta between the component and the ambient environment, ensuring optimal efficiency no matter the application.

Conclusion: The ATS-03C-63-C2-R0 is an excellent choice for any electrical or electronic component that requires superior thermal control. Its lightweight construction, excellent thermal dissipation, and efficient design make it a great choice for use in a variety of applications, including LED lights, CPUs, CPUs and other microprocessors, motor controllers, and other components in large data centers. Whether used in commercial applications or in consumer-grade hardware, the ATS-03C-63-C2-R0 ensures that the thermal requirements of the application are met in a safe and effective manner.The specific data is subject to PDF, and the above content is for reference

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