| Allicdata Part #: | ATS6370-ND |
| Manufacturer Part#: |
ATS-03C-67-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-67-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are designed to disperse the heat from an electronic component, helping to maintain the optimal temperature for proper operation. The ATS-03C-67-C2-R0 is a specialized thermal heat sink that is used in a wide range of applications for cooling different types of electronic components. This article provides information about the application fields and working principles of the ATS-03C-67-C2-R0.
The ATS-03C-67-C2-R0 is designed for use with integrated circuits and other electronics components. It is specifically designed for applications where the device must be capable of dissipating a large amount of heat quickly and efficiently. It is commonly used in embedded electronic applications, as well as in computer cooling solutions. It can also be used for gaming consoles, car starters, LED lighting systems, and other applications that require efficient cooling solutions.
The ATS-03C-67-C2-R0 features a unique construction that utilizes a combination of direct and indirect cooling. The cooling process involves two separate processes: first, air is drawn in via the side vents and then pushed outward by the fan blades; then, the heat is dissipated by two heat pipes that cool the internal components. The process helps to ensure that the temperature of the component remains at a safe operating level. The heat pipe also helps to keep the air free of condensation.
The ATS-03C-67-C2-R0 also features a specialized mounting system that allows it to be mounted in tight spaces such as compact embedded systems. The mounting system includes a series of spring-loaded clips that make it easier for the heat sink to be installed in applications where space is limited. The ATS-03C-67-C2-R0 also has a light-weight aluminum design that makes it suitable for use in smaller spaces.
The working principle of the ATS-03C-67-C2-R0 involves a combination of heat dissipation, convection, and airflow. The air is drawn in via the front vents and pushed outward by the fan blades. The air then flows over the heat pipe and dissipates the heat from the internal components. The convection current created by the fan blades helps to keep the component cool. The aluminum fins are designed to actively dissipate the heat by allowing the heat to dissipate directly over the surface of the component.
The ATS-03C-67-C2-R0 is designed to provide efficient cooling of various components and devices. It is a reliable and versatile thermal heat sink that can be used in a wide range of applications. It is a dependable and cost-effective cooling solution for embedded systems, digital signal processing, gaming consoles, and various other electronic devices.
The specific data is subject to PDF, and the above content is for reference