| Allicdata Part #: | ATS-03C-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components used to move, control and dissipate heat in many different applications. They are often made from metal alloy such as aluminum or copper and use a variety of techniques to maximize the thermal transfer from the source into the surrounding medium. ATS-03C-70-C1-R0 is an example of a heat sink that moves, controls, and dissipates heat in industrial applications.
ATS-03C-70-C1-R0 Application Field
This advanced heat sink is designed for applications involving high power density and large temperature variations. Its advanced design is suitable for use in ambient and high temperature environments. It can be used with various cooling fluids, including mineral oil, ethylene glycol, and other liquids. The design of the heat sink also works well with air cooling and provides excellent thermal diffusion. As a result, ATS-03C-70-C1-R0 is often used in automotive, power electronics, industrial control, and semiconductor industries.
ATS-03C-70-C1-R0 Working Principle
The ATS-03C-70-C1-R0 heat sink utilizes a radial-flow pattern to effectively dissipate heat. The heat sink utilizes fins that are arranged in a radial pattern. This pattern provides increased surface area for the heat to be transferred into the surrounding environment. As the coolant flows through the fins, heat is dissipated, resulting in a Cooling effect. Additionally, the aerodynamic design of the heat sink allows for improved cooling even at low air speeds. Furthermore, the unit is designed to maintain a constant temperature in order to ensure optimal performance.
Conclusion
The ATS-03C-70-C1-R0 heat sink is an advanced device specifically designed to efficiently move, control, and dissipate heat in different industrial applications. It has an aerodynamic design and radial-flow pattern that enable it to perform well in a variety of high temperature and low air speed conditions. As a result, this heat sink is popular among automakers, power electronics, industrial control, and semiconductor companies.
The specific data is subject to PDF, and the above content is for reference