| Allicdata Part #: | ATS6383-ND |
| Manufacturer Part#: |
ATS-03C-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03C-80-C2-R0 is a type of thermal - heat sink, used in many applications in order to dissipate excessive heat energy. It can be used in any application where high thermal performance, low thermal resistance, and low power dissipation are required, such as in electronic components, electric motors and storage devices. Heat sinks are designed to absorb and dissipate heat, drawing it away from critical components and utilizing the outside environment to cool the system.
The ATS-03C-80-C2-R0 device is designed to provide a tight fit between the heat sink and the component it is mounted to. This is done through “screw locking” which keeps the device in place. By providing a tight fit, it ensures that the heat generated by the component is effectively dissipated through the heat sink, resulting in low power dissipation and improved thermal performance.
The ATS-03C-80-C2-R0 is made of a non-conductive material which features excellent thermal conductivity. This allows for rapid heat conduction, ensuring efficient distribution of heat evenly across the surface of the heat sink. This also ensures that heat is quickly conducted away from the component, cooling it quicker and more efficiently. Additionally, the non-conductive material minimizes any potential electrical interference between the component and the heat sink.
The key working principle of the ATS-03C-80-C2-R0 device is based on ‘heat flux’, or the amount of heat transmitted through an object. It is composed of various layers of metal and insulation that work together to create as high a heat flux as possible. Heat flux is achieved through the efficient conductivity and thermal transfer of the device, and it is this conductivity which ensures that the ATS-03C-80-C2-R0 is able to effectively dissipate heat away from the component it is mounted to.
The ATS-03C-80-C2-R0 is an effective device used in various applications due to its excellent thermal performance, low thermal resistance, and efficient heat dissipation. The non-conductive material used in its construction ensures that components are not damaged by electrical interference, and its tight fit provides the device with the necessary thermal performance to ensure both it and the component it is mounted to operate efficiently and safely.
The specific data is subject to PDF, and the above content is for reference