| Allicdata Part #: | ATS-03C-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-03C-82-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are designed to dissipate heat generated by electronic and electrical components. They are an essential part of any electronic application where dissipating heat is a critical factor. ATS-03C-82-C3-R0 is a common type of thermal heat sink designed for a variety of applications.
The ATS-03C-82-C3-R0 heat sink is an advanced design featuring a combination of high-performance heat dispersion and low power consumption. The heat sink is constructed of a anodized aluminum base, which is connected to a series of finned aluminium ribs, that act to increase the surface area of the heat sink and thereby increase the efficiency of heat dispersion. The heat sink is also equipped with a high wattage, low pressure fan and engineered airflow channels to enhance air circulation. The design enables the component to dissipate heat quickly and efficiently.
The ATS-03C-82-C3-R0 heat sink is designed for use in applications ranging from medical, military, industrial, and other commercial applications. It has been used in a variety of applications, including the cooling of high-power transistors, high-performance microprocessors, and high-powered laser diodes. Its low power consumption and high efficiency make it ideal for use in computer applications, where the components require large amounts of energy.
In order to work properly, the ATS-03C-82-C3-R0 heat sink needs to be connected to a power source, such as a DC power supply, AC adapter, or a solar panel. Once the power is supplied to the heat sink, the fan on the back side of the heat sink will turn on and start circulating air into the heat sink. As the air enters the heat sink, it will start to transfer the heat from the components to the heat sink. The finned ribs of the heat sink will then distribute the heat away from the component and out of the device.
The ATS-03C-82-C3-R0 is a popular heat sink for a variety of applications because it is relatively small, and yet it can dissipate large amounts of heat. Its low power consumption allows for it to be used in a variety of environments, including applications that require low power consumption, as well as applications that utilize high power components. The efficiency and small size make this heat sink suitable for use in designs where space is limited.
In addition to its use in general applications, the ATS-03C-82-C3-R0 has also been used in industrial applications that require the removal of large amounts of heat, such as laser diodes and other specialized electronic components. The design is robust, efficient, and extremely easy to install, and with its advanced cooling capabilities it can help to improve the efficiency and performance of a variety of applications.
The specific data is subject to PDF, and the above content is for reference