| Allicdata Part #: | ATS-03C-83-C1-R0-ND |
| Manufacturer Part#: |
ATS-03C-83-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03C-83-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor in any electronic system that is operating in an environment which is subject to extreme temperatures or extended high duty cycles. In order to ensure that the system is kept within its safe operating temperatures and that components are not damaged by overheating, various active and passive thermal management techniques are used. One of the most popular and efficient solutions for controlling component temperature is to use heatsinks. ATS-03C-83-C1-R0 is a popular aluminum heatsink designed for power electronic applications in a variety of environments.
ATS-03C-83-C1-R0 is made out of a high quality extruded aluminum, and is designed to provide high thermal performance and reliability in a wide range of applications. The aluminum comes with an anodized finish for corrosion protection, making it suitable for a variety of environments. The enhanced fins provide increased heat dissipation area for efficient cooling. It is designed with a clamp system for easy installation and has features that allow for efficient and effective thermal management.
The ATS-03C-83-C1-R0 is ideally suited to applications that require high power and high speed operation. This heat sink is well suited for high-temperature, high-power electronic power supplies, power transistors, motor drives, LEDs, and various linear ICs. It is designed to provide superior thermal resistance and a wide range of features for efficient and effective thermal management.
The ATS-03C-83-C1-R0 is designed to dissipate heat from the component via a thermal gap between the bottom of the heat sink and the component. Heat from the component is absorbed by the aluminum and conducted through the fin structure. The heat is then dissipated through the extended fin surface area, which increases the convective heat transfer coefficient. The heat is then passed through the fin structure to the surrounding environment, lowering the component temperature and its overall thermal resistance.
The ATS-03C-83-C1-R0 is a high performance heatsink that is capable of efficiently cooling components in high temperature and high duty cycle operations. It offers a wide range of features for efficient and effective thermal management, and features an anodized finish for corrosion protection. Combined with its ease of installation and superior thermal properties, this heatsink is an excellent choice for power electronic applications.
The specific data is subject to PDF, and the above content is for reference