| Allicdata Part #: | ATS-03D-04-C1-R0-ND |
| Manufacturer Part#: |
ATS-03D-04-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03D-04-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics is an essential component of modern technology. As electronic products become increasingly compact and power-hungry, efficient cooling solutions are needed to ensure maximum performance and reliability. Heat sinks are the ideal solution for dissipating heat away from sensitive components, controlling temperature and preventing potential damage or failure of the system. The ATS-03D-04-C1-R0 Heat Sink is a high-performance device specifically designed for cooling applications in the electronics industry.
The ATS-03D-04-C1-R0 is capable of removing large amounts of heat from components requiring active cooling. This heat sink is comprised of a combination of aluminum and plastic components, specifically designed to maximize both thermal performance and mechanical stability. The aluminum components act as a heat-transfer medium, while the plastic parts are used to mount the heat sink into a specific application or environment. It also features a feature-rich design, featuring extended fins to allow for better airflow than other available solutions.
The ATS-03D-04-C1-R0 Heat Sink is ideal for applications requiring high-performance cooling solutions. This heat sink is suitable for a wide range of applications, from high-performance computer systems to industrial automation. Additionally, this device is well-suited for use for embedded systems, such as display and imaging equipment, to prevent equipment from overheating. The ATS-03D-04-C1-R0 is known for its compatibility with almost any cooling system, allowing it to fit seamlessly into any design and environment.
The working principle behind the ATS-03D-04-C1-R0 is simple but effective. Heat from the components is conducted through the aluminum components and dispersed out through the fins of the heat sink. The plastic components are used to offer enhanced mechanical stability, as well as providing a secure mounting system for the heat sink. This design ensures that the heat sink is properly mounted without impacting the thermal performance of the device and offering maximum behavior control.
The ATS-03D-04-C1-R0 is an ideal solution for providing effective thermal management in demanding applications. This device offers superior cooling performance, improved mechanical stability, and a secure mounting system. Additionally, its affordability and compatibility with almost any cooling system make it the ideal choice for cooling components in the modern electronics industry.
The specific data is subject to PDF, and the above content is for reference