ATS-03D-107-C3-R1 Allicdata Electronics
Allicdata Part #:

ATS-03D-107-C3-R1-ND

Manufacturer Part#:

ATS-03D-107-C3-R1

Price: $ 4.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X40X9.5MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-107-C3-R1 datasheetATS-03D-107-C3-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.44150
30 +: $ 4.19496
50 +: $ 3.94808
100 +: $ 3.70138
250 +: $ 3.45462
500 +: $ 3.20786
1000 +: $ 3.14617
Stock 1000Can Ship Immediately
$ 4.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.969" (50.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 28.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions can often be hard to understand from a technical perspective. Fortunately, these days there are options like the ATS-03D-107-C3-R1 that provide a reliable and cost-effective way to manage temperature and keep sensitive components cool.

The ATS-03D-107-C3-R1 is a heat sink designed specifically for applications that require effective thermal management. It is made of highly durable aluminum alloy and has a low profile design which makes it perfect for tight spaces. It is also designed to be aesthetically appealing, with a clean white finish that will blend in well with many different types of environments.

So how does this heat sink work? The ATS-03D-107-C3-R1 works by creating a barrier between the hot component and the colder surface. This barrier helps to reduce the amount of heat exchange between the two surfaces.

The heat sink itself consists of a series of fins which help to increase the surface area and allow the heat to be dissipated more quickly and efficiently. The fins also help to prevent any built-up heat from spreading to other areas, as the design ensures that the heat transfer is directed away from the components.

These features make the ATS-03D-107-C3-R1 an ideal solution for a variety of applications that require effective thermal management. It is designed to work with a variety of components ranging from processors, controllers, and GPUs, to embedded systems, servers, and more.

The ATS-03D-107-C3-R1 is designed to provide reliable and long-lasting cooling performance. It is also easy to install and requires minimal maintenance, making it ideal for any application where effective and efficient thermal management is required.

In summary, the ATS-03D-107-C3-R1 is a highly efficient and cost-effective way to manage the temperatures of components in any application. It is designed with a low profile and aesthetically pleasing design, and is capable of providing reliable and long-lasting cooling performance. It is easy to install and maintain, and is ideal for a variety of applications that require effective thermal management.

The specific data is subject to PDF, and the above content is for reference

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