ATS-03D-110-C2-R1 Allicdata Electronics
Allicdata Part #:

ATS6424-ND

Manufacturer Part#:

ATS-03D-110-C2-R1

Price: $ 5.59
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-110-C2-R1 datasheetATS-03D-110-C2-R1 Datasheet/PDF
Quantity: 1000
1 +: $ 5.07780
10 +: $ 4.93920
25 +: $ 4.66452
50 +: $ 4.39022
100 +: $ 4.11585
250 +: $ 3.84146
500 +: $ 3.56707
1000 +: $ 3.49848
Stock 1000Can Ship Immediately
$ 5.59
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The Thermal - Heat Sinks industry is rapidly changing with the development of technology. ATS-03D-110-C2-R1 is one of the current products on the market that’s changing the way thermal management is done. It’s a compact, lightweight, and high-performance heat sink. Its application field and working principle can have a huge impact on modern companies’ systems.

The ATS-03D-110-C2-R1 is mainly used in high-power semiconductor devices and is specially designed to work with high-current outputs. This heat sink is able to handle thermal loads up to 110 dB and it offers excellent thermal conductivity, meaning it can easily handle large amounts of heat. It also features a wide range of mounting options, making it suitable for a variety of applications.

The ATS-03D-110-C2-R1 works by using a combination of a large aluminum and copper base and fins. The fins improve the airflow around the heat sink, allowing it to increase its thermal management efficiency. The aluminum and copper base also act as a heat spreader, ensuring that the heat is spread evenly throughout the device, helping the heater to cool quickly and efficiently. This combination of aluminum and copper increases the efficiency of the ATS-03D-110-C2-R1.

The ATS-03D-110-C2-R1 heatsink is mainly used for power amplifiers, laser diode drivers, high-power transistors, voltage regulation modules, LED drivers, thermal display modules, and other high-power applications. Its application field can be extended to include industrial-grade machines, medical equipment, and aerospace components. It can also be used in automotive applications such as providing thermal regulation for engines and other equipment.

Its operating principle is simple and straightforward. The heat generated by the power source is transferred to the aluminum and copper core of the heat sink. The aluminum and copper core dissipates the heat to the fins. The fins act as a cooling system, dissipating the heat to the surrounding air. To ensure maximum performance, the heat sink must be installed correctly and the air vents must be open.

The ATS-03D-110-C2-R1 heatsink is highly efficient and reliable, making it an excellent choice for a variety of applications. Its application field is varied and can easily be incorporated into a range of devices that require high-performance thermal management. Thanks to its combination of aluminum and copper, the ATS-03D-110-C2-R1 is able to handle large amounts of heat while remaining lightweight and compact.

The specific data is subject to PDF, and the above content is for reference

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