ATS-03D-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03D-117-C1-R0-ND

Manufacturer Part#:

ATS-03D-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-117-C1-R0 datasheetATS-03D-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important part of any system, as it ensures that components of any system are not heated to levels which can cause them to malfunction or even fail catastrophically. Heat sinks are one of the primary ways used to manage the amount of heat each component of the system produces.

The ATS-03D-117-C1-R0 is a passively cooled finned aluminum heat sink from the ATS line of thermal conductive heat sinks by VIPA-Kelko. This product is designed to efficiently dissipate heat from components while occupying minimal space in an enclosure. This heat sink is suitable for a wide variety of applications.

The ATS-03D-117-C1-R0 is designed with a direct thermal path between the heat source and the cooling fins. It features a total of 17 fins of aluminum alloy, with each fin measuring 77mm in height and 9.1mm in width. This height of the fins gives it a total cooling surface area of 1.27sqm, which provides it with excellent thermal performance. The top of the heat sink features three mounting pops with a maximum mounting area of 20mm x 8mm.

Due to the size and shape of the fins, air from outside the enclosure flows through the fins and can carry away heat generated by the components. This passive cooling method serves to decrease the temperature of the heat source, while maintaining the temperature of other components within the system. The ATS-03D-117-C1-R0 is designed to combine thermal efficiency with maximum compatibility and is suitable for high power components, especially components with wattage power in excess of 30W.

The ATS-03D-117-C1-R0 is designed with a direct thermal path from the heat source to the cooling fins. This ensures that heat is transferred more efficiently from the heat source to the fins, where it is then dissipated by the natural flow of air. The direct thermal path also helps reduce the temperature differential between the heat source and the fins, ensuring more efficient thermal management.

This heat sink is suitable for a wide variety of applications, including but not limited to, LED lighting, optical communications, power supplies, industrial automation, home automation, automotive, and medical applications. In these applications, the heat sink can be used to dissipate the heat generated by high power components, ensuring that they are able to operate properly.

Overall, the ATS-03D-117-C1-R0 is an efficient and reliable heat sink, designed to efficiently dissipate and manage the heat generated by components. It features a direct thermal path from the heat source to the fins, allowing for more efficient heat management. Its 17 aluminum fins provide an ample surface area for heat to dissipate into the natural flow of air. This product is designed to provide optimum thermal performance and is suitable for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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