| Allicdata Part #: | ATS-03D-133-C1-R0-ND |
| Manufacturer Part#: |
ATS-03D-133-C1-R0 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-03D-133-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.41°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are an essential component in many electronics systems, and they can be used to manage the temperature of their surroundings and regulate the distribution of heat generated by components or processes. ATS-03D-133-C1-R0 is a thermal management solution that offers enhanced versatility, scalability, and usability in a variety of applications.
The ATS-03D-133-C1-R0’s design utilizes a copper-alloy outside casing that dissipates any excess heat quickly and efficiently. The inner core consists of a monoblock module constructed from graphite fin sheets which contains a Peltier-cooled thermoelectric module. The thermoelectric module is a versatile cooling solution that uses the temperature difference between its two sides to generate a cooling effect.
The ATS-03D-133-C1-R0’s cooling capability offers the set of benefits of decreased system temperature, decreased power consumption, and increased system longevity. The heat sink’s working principle is based on the Peltier effect; the temperature difference between the two sides of the thermoelectric module establishes a current through it, resulting in a cooling effect when heat is being dissipated. Heat is moved from the hot side to the cold side, and consequently, the temperature of the cold side is shifted, allowing for improved thermal management.
The ATS-03D-133-C1-R0 provides highly precise temperature control with a wide range of applications. It functions effectively for medical devices, consumer electronics, mechatronics, aerospace equipment, and other fields of use. It makes usage of cooling technologies such as liquid cooling, air cooling, and thermoelectric cooling, making it a highly versatile solution for temperature management and more.
The ATS-03D-133-C1-R0 is an effective tool for keeping components and systems at their optimal temperature, enabling efficient and reliable performance. With its extensive range of benefits and applications, its effectiveness and innovative design, it is an ideal thermal management solution for many purposes.
The specific data is subject to PDF, and the above content is for reference
ATS-03D-133-C1-R0 Datasheet/PDF