| Allicdata Part #: | ATS-03D-149-C1-R0-ND |
| Manufacturer Part#: |
ATS-03D-149-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03D-149-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component of many electronic systems. The ATS-03D-149-C1-R0 heat sink is a component designed specifically for efficient and reliable thermal management and cooling of electronic components. With its unique design, it provides a low-cost and reliable solution for cooling electronic components, even under extreme conditions.
The ATS-03D-149-C1-R0 is a heat sink designed to provide efficient cooling for a wide range of applications, ranging from computer and industrial electronics, to military and aerospace applications. This heat sink is designed with a modular design, allowing for easy integration into a wide range of systems. It is capable of dissipating up to 20 watts of heat in less than 2 milliseconds, with a maximum airflow of up to 95CFM.
The ATS-03D-149-C1-R0 features a unique combination of features that make it an ideal choice for a wide range of cooling applications. First, it features a low-profile design which allows it to be incorporated into a wide range of system architectures. Second, this heat sink offers high thermal performance with low air flow restriction, making it suitable for use in applications where air flow is limited. Third, the ATS-03D-149-C1-R0 is designed to dissipate heat evenly over the fins, allowing for greater thermal performance. Finally, these heat sinks are designed with a lightweight aluminum alloy allowing for easy installation and maintenance.
The ATS-03D-149-C1-R0 is designed to work in combination with a variety of fans to maximize the cooling capabilities of the heat sink. As the fans draw air through the fins, the natural convection created by the fan\'s motion drives the hot air from the dissipating fins and out of the system. Additionally, the ATS-03D-149-C1-R0 features a unique fin pattern which acts as a labyrinth effect that further increases the heat transfer from the component to the air flow. This labyrinth pattern also works in conjunction with the fans to create an effective cooling system.
In addition to the cooling capabilities of the ATS-03D-149-C1-R0 heat sink, its unique design features make it highly suitable for use in a wide range of applications. This heat sink is designed to be durable and reliable, able to withstand harsh environments and extreme temperatures. It is also designed to be mechanically sturdy, making it suitable for highly vibration-prone environments. Additionally, the ATS-03D-149-C1-R0 also features a low noise performance, making it suitable for use in noise-sensitive applications.
The ATS-03D-149-C1-R0 is an efficient and reliable thermal management and cooling solution for a wide variety of applications. Its unique design features make it an ideal choice for a range of electronic systems, including those in computer and industrial systems, military and aerospace applications, and consumer electronics. By providing efficient heat dissipation and high performance, the ATS-03D-149-C1-R0 is able to provide a reliable and low-cost solution for cooling high-temperature electronic components.
The specific data is subject to PDF, and the above content is for reference