ATS-03D-165-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS6484-ND

Manufacturer Part#:

ATS-03D-165-C2-R0

Price: $ 3.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X10MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-165-C2-R0 datasheetATS-03D-165-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.01770
10 +: $ 2.93643
25 +: $ 2.85692
50 +: $ 2.69829
100 +: $ 2.53953
250 +: $ 2.38085
500 +: $ 2.30148
1000 +: $ 2.06339
Stock 1000Can Ship Immediately
$ 3.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-03D-165-C2-R0 is a type of thermal-heat sink, which is widely used for its remarkable heat transfer capability. It is used in a wide variety of applications, from cooling small components to dissipating heat in large-scale industrial applications.

Its main function is to transfer heat away from the component which is connected to it. As heat generated by electrical components is usually dissipated through the component’s housing, the rate of heat transfer is usually very slow. This is why thermal-heat sinks are needed: they provide an additional pathway for the heat to escape.

The ATS-03D-165-C2-R0 utilizes a simple but effective design to improve heat transfer efficiency. Its main components include a series of fins attached to a base plate. The fins work to draw heat away from the component, while the base plate disperses the heat into the surrounding air.

In addition to the fins and the base plate, the thermal-heat sink also utilizes a fan to speed up the heat dissipation process. The fan draws in air from the sides of the heat sink and forces it through the fins. This further helps to speed up the heat transfer process, making it effective even in crowded environments.

The ATS-03D-165-C2-R0 also uses a thermal paste between the component and the base plate to improve the heat transfer rate even further. The thermal paste helps to increase the contact area between the component and the base plate, allowing the heat to escape quickly and effectively.

Overall, the ATS-03D-165-C2-R0 is a great choice for any application requiring reliable heat transfer. It is capable of transferring heat away from components quickly and efficiently, and is suitable for a wide range of applications. Whether you’re dealing with small components or large industrial installations, the ATS-03D-165-C2-R0 can provide the performance you need.

The specific data is subject to PDF, and the above content is for reference

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