ATS-03D-169-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03D-169-C1-R0-ND

Manufacturer Part#:

ATS-03D-169-C1-R0

Price: $ 3.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-169-C1-R0 datasheetATS-03D-169-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.97234
30 +: $ 2.89170
50 +: $ 2.73105
100 +: $ 2.57040
250 +: $ 2.40975
500 +: $ 2.32942
1000 +: $ 2.08845
Stock 1000Can Ship Immediately
$ 3.27
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.66°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is essential for any electronic system and heat sinks are becoming increasingly important as high powered components and smaller packages continue to be more and more common in the market. ATS-03D-169-C1-R0 heat sinks provide an efficient way to dissipate heat from multiple heat sources to prevent overheating. This article will discuss the application field and working principle of ATS-03D-169-C1-R0 heat sinks.

ATS-03D-169-C1-R0 heat sinks are designed for use in a variety of applications, ranging from consumer electronics to automotive and industrial systems. These heat sinks are typically used in applications where there are multiple heat sources that need to be dissipated and where the heat dissipated must be effectively contained. They are also used when the operating conditions are harsh, such as in an automotive environment where temperature and vibration are high.

The ATS-03D-169-C1-R0 heat sinks feature a large array of fins with high thermal conductivity. The fins are arranged in an optimal pattern that maximizes the heat transfer rate from the heat sources. The fins also have an anodized coating to improve corrosion resistance and improve thermal efficiency.

The heat sinks are designed to use a combination of air convection, radiation, and conduction to effectively dissipate heat. Air convection works by using air to create a "convection current" which draws heat from the source to the fins. Radiation, on the other hand, is the direct transfer of heat energy from the source to the fins via infrared radiation. Finally, conduction involves directly transferring heat energy through contact between the source material and direct contact with the fins.

The fins of the ATS-03D-169-C1-R0 are designed to dissipate heat quickly and efficiently. They feature a curved surface that creates a “vortex effect”, which helps to draw heat away from the source to the fins. Additionally, the fins are designed to be spaced close together to create a more uniform cooling effect, while still allowing air to pass through the fins in order to maximize cooling.

In addition to the fin design, the ATS-03D-169-C1-R0 heat sinks also feature a flat base that is designed to evenly distribute heat across the entire surface. This ensures that the heat is spread out evenly across the fins to provide maximum cooling efficiency.

The ATS-03D-169-C1-R0 heat sinks are designed to be used in a wide variety of applications, from automotive and industrial systems to consumer electronics. They are a reliable and efficient way to dissipate heat from multiple heat sources, ensuring that any system remains cool and stable. Additionally, the fins are designed to provide optimized cooling performance while also being corrosion-resistant and able to withstand high temperatures and vibration.

By using these ATS-03D-169-C1-R0 heat sinks, system designers can rest assured that their systems will remain operational, and that their components will remain safe from heat damage. By combining air convection, radiation, and conduction, these heat sinks are able to provide an efficient and reliable cooling solution for any application.

The specific data is subject to PDF, and the above content is for reference

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