| Allicdata Part #: | ATS-03D-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-03D-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03D-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management, or the process of controlling the temperatures of a device or system, is an important part of the overall performance of a wide variety of applications. Heat sinks are one of the most commonly used tools in this process for dissipating heat, and it is important to identify the right type for any given application. The ATS-03D-198-C3-R0 is a cost-effective solution for providing excellent thermal management for devices such as Smartphones, medical equipment, industrial automation systems, and more.
The ATS-03D-198-C3-R0 is a heat sink that is made from aluminum and is designed with an internal cavity that is able to hold a large amount of heat-producing components. It is incredibly efficient at heat dissipation, providing up to 17.2 Watts of steady-state heat transfer with minimal airflow needed, while maintaining a high surface temperature (over 80°C). The top surface has circular patterns that create high-efficiency fins, providing better air circulation and heat transfer capabilities. The bottom surface is covered with thermal adhesive tape, allowing it to be securely mounted to the host PCB, creating a reliable heat interface.
Another important feature of the ATS-03D-198-C3-R0 is its space-saving design, which allows it to fit into small electronic devices. Its small size also helps maintain a lightweight construction and low acoustic noise, making it suitable for use in applications where acoustic noise is an issue. In addition, this heat sink can be customized according to customer needs for various special applications.
The working principle of the ATS-03D-198-C3-R0 is based on the principle of natural convection. This type of heat sink uses the natural airflow created by rising warm air from its surface to dissipate the heat from components, thus cooling them. This makes the ATS-03D-198-C3-R0 an excellent solution for applications where forced air cooling is not feasible or inconvenient.
The ATS-03D-198-C3-R0 is a great choice for applications that require efficient heat dissipation without creating too much noise. It is perfect for use in high-performance applications such as Smartphones, medical devices, autonomous vehicles, education robots, computers, and many more. It is also a cost-effective solution as it is designed for easy installation and can be customized according to specific needs.
The specific data is subject to PDF, and the above content is for reference