| Allicdata Part #: | ATS-03D-40-C3-R0-ND |
| Manufacturer Part#: |
ATS-03D-40-C3-R0 |
| Price: | $ 6.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03D-40-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.76009 |
| 30 +: | $ 5.44026 |
| 50 +: | $ 5.12026 |
| 100 +: | $ 4.80022 |
| 250 +: | $ 4.48021 |
| 500 +: | $ 4.16019 |
| 1000 +: | $ 4.08019 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Thermal management is an important part of electronics design and manufacture, and the ATS-03D-40-C3-R0 is a heat sink designed to efficiently dissipate and transfer the heat generated by an electronics component. The ATS-03D-40-C3-R0 is designed to be used as a thermally conductive interface material in direct contact with a component, such as a power transistor or IC die, that generates heat during operation. Heat is rapidly transferred from the component to the thermally conductive interface material, and then dissipated to the surrounding environment through the body of the heatsink.
The ATS-03D-40-C3-R0 heat sink is designed to be mounted on a PCB with its surface fully exposed to the incoming airflow. The design of the heatsink includes embedded fins and channels which allow the air to pass freely over the entire heatsink body. The air passing over the heatsink evaporates the heat present in it and thus efficiently transfers it from the heatsink to the environment. This design allows for maximum air-to-heatsink contact area and thus maximizes the thermal transfer performance of the device.
The ATS-03D-40-C3-R0 heat sink is rated for an operating temperature of 39°C and is suitable for use in a variety of applications. It can be used in a number of power electronics systems, such as DSPs, processors, amplifiers, inverters, LED lighting, and cellular base stations. Additionally, it can be used in audio and video equipment and medical equipment, as well as in industrial and automotive applications. The wide operating temperature range is also a significant factor in its usefulness, as it can be used in both low-temperature and high-temperature applications.
The ATS-03D-40-C3-R0 heat sink features a simple yet efficient design. It is made from aluminum alloy and features a natural anodized surface for corrosion resistance and enhanced heat conduction. The embedded fins and channels enable the dissipation of the generated heat, while the anodized aluminum allows for good thermal conductivity. Additionally, the heatsink is designed to be thin, lightweight, and easy to install, making it an ideal choice for many applications.
In summary, the ATS-03D-40-C3-R0 is a efficient and reliable heat sink designed for a variety of electronics applications. It maximizes the air-to-heatsink contact area and efficiently dissipates heat from the component to the surrounding environment. The device is rated for an operating temperature of 39°C, and its natural anodized aluminum construction makes it an ideal choice for applications that require thermal management.
The specific data is subject to PDF, and the above content is for reference