ATS-03D-78-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-03D-78-C3-R0-ND

Manufacturer Part#:

ATS-03D-78-C3-R0

Price: $ 3.82
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-78-C3-R0 datasheetATS-03D-78-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.47004
30 +: $ 3.27726
50 +: $ 3.08448
100 +: $ 2.89170
250 +: $ 2.69892
500 +: $ 2.50614
1000 +: $ 2.45794
Stock 1000Can Ship Immediately
$ 3.82
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The use of thermal management solutions is often an integral part of many types of modern electronics. As such, choosing the correct thermal management solution can be a difficult and confusing task for those who are new to this type of technology. One such thermal management solution is the ATS-03D-78-C3-R0.

The ATS-03D-78-C3-R0 is part of the thermal-heat solutions family. It is an axial thermal heat sink designed to efficiently move heat away from electronic components. The sink is designed to fit in a variety of different configurations, making it ideal for use in a wide variety of applications. It is capable of supporting a wide range of temperatures, making it a great choice for applications that require reliable thermal management.

In order to better understand how the ATS-03D-78-C3-R0 works, we must first understand the principles of thermal management. Thermal management is the process by which heat from a source is dissipated from the components of a system. In this case, the heat source is generated by the electronics that are housed in the device. The thermal management solution moves the heat away from the electronics, allowing the CPU to operate at a more optimal temperature.

The ATS-03D-78-C3-R0 works by utilizing a combination of aluminum fins and a copper heat-pipe. The fins are designed to maximize the amount of surface area for heat dissipation, while the heat-pipe is used to efficiently move the heat away from the components. The heat-pipe is filled with a special liquid that acts as a thermal conductor, transferring the heat from the electronics to the fins. The fins then disperse the heat into the surrounding environment, keeping the electronics cool.

The ATS-03D-78-C3-R0 has a wide range of applications. The sink is commonly used in consumer and industrial electronics, from small micro circuits to larger components such as CPUs and GPUs. It can also be used to provide thermal management in battery packs, creating a safer and more reliable system. Additionally, it is often used in LED lights to reduce the temperature of the LEDs and prevent them from overheating.

The ATS-03D-78-C3-R0 is a great example of how thermal management solutions can be used in a variety of applications. Utilizing the principals of thermal management, it is capable of efficiently removing heat from the components housed in the device. This helps to ensure that the electronics function properly and stay cool, allowing the device to continue working reliably and efficiently.

The specific data is subject to PDF, and the above content is for reference

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