ATS-03D-90-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-03D-90-C3-R0-ND

Manufacturer Part#:

ATS-03D-90-C3-R0

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03D-90-C3-R0 datasheetATS-03D-90-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.95577
30 +: $ 3.73611
50 +: $ 3.51628
100 +: $ 3.29654
250 +: $ 3.07677
500 +: $ 2.85700
1000 +: $ 2.80206
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal - Heat Sinks are an important and critical component in a variety of industrial and consumer applications. Thermal management is essential in these applications to ensure optimum performance and reliability. ATS-03D-90-C3-R0 heat sinks are one of the leading products on the market offering high performance and reliability. In this article, we will explain the application field and working principle of the ATS-03D-90-C3-R0 heat sink.

Application Field

The ATS-03D-90-C3-R0 is a top choice of heat sinks for applications requiring optimal cooling with a low profile design. These heat sinks are designed to operate reliably in extreme temperatures, such as those found in telecommunication systems, cpu cooling systems, rf amplifier applications and various medical applications. In order to effectively cool the components in these applications, it is important to remove the heat away from the components quickly and efficiently. The ATS-03D-90-C3-R0 heat sink has a high thermal conductivity and a very low thermal resistance, which allows the heat to be dissipated quickly and efficiently. The heat sink also has an aerodynamic design which allows air to flow over the components quickly and efficiently, ensuring that the components are kept at a low temperature.

Working Principle

The ATS-03D-90-C3-R0 heat sink works on the principle of thermodynamics. The heat generated by the components is dissipated by the heat sink due to the differences in temperature between the thermal surface of the heat sink and the ambient air. The heat sink absorbs the heat, allowing it to be dissipated more quickly. The thermal surface of the heat sink is designed to maximize heat dissipation and minimize line losses. The heat sink also uses an air convection chamber to maximize the flow of air over the components. This allows air to move more efficiently over the heat sink, dissipating the heat away quickly.

The ATS-03D-90-C3-R0 heat sink also features a high thermal conductivity and low thermal resistance. This ensures that the heat is absorbed quickly and efficiently by the heat sink. The heat is then dissipated away quickly and efficiently, keeping the components at a low temperature and avoiding any thermal failures. The heat sink also features a silent fan design which ensures low noise levels.

Conclusion

In conclusion, the ATS-03D-90-C3-R0 heat sink is an excellent product for applications requiring thermal management. The heat sink operates reliably in extreme temperatures and features a high thermal conductivity, low thermal resistance, aerodynamic design and a silent fan design. These features make the ATS-03D-90-C3-R0 heat sink an ideal choice for applications requiring efficient cooling with a low profile design.

The specific data is subject to PDF, and the above content is for reference

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