| Allicdata Part #: | ATS6607-ND |
| Manufacturer Part#: |
ATS-03E-07-C2-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-07-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.52800 |
| 10 +: | $ 3.43539 |
| 25 +: | $ 3.24450 |
| 50 +: | $ 3.05361 |
| 100 +: | $ 2.86278 |
| 250 +: | $ 2.67193 |
| 500 +: | $ 2.48108 |
| 1000 +: | $ 2.43337 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03E-07-C2-R0 is a highly efficient thermal - heat sink that is designed for applications such as cooling, dissipating heat, and providing general thermal management. While it can be used for various purposes, it is mainly used in the manufacturing of electronic and computer devices. It is also a welcome addition to any engineering, research, and development environment due to its various functions.
The ATS-03E-07-C2-R0 is a highly competent heat sink design with availability in both horizontal and vertical designs. It features a fast airflow design to achieve maximum heat dissipation on any system. Additionally, it also features an appropriate air passage design that is specially optimized for maximum performance. This heat sink design also features scale-shaped fins that have been specially designed to offer optimal dissipating performance for any type of application.
In terms of working principle, this heat sink design utilizes a combination of thermal conductivity and convection in order to remove heat from an electronic device. This type of heat sink is designed so that when it is placed over an electronic component, heat will first transfer from the semiconductor component to the base plate of the heat sink. The base plate is made of thermally conductive material, which is designed to absorb and transfer the heat that is generated by the component. Once the heat is transferred to the base plate, it is then dissipated out of the system by convection.
The base plate on the ATS-03E-7-C2-R0 thermal - heat sinks is typically formed with a flat surface. This flat surface is then connected to a number of fins, which are arranged around the base plate to form a natural fan structure. This structure is designed to effectively dissipate heat by directing air flow through the fins. The fins are also specially designed to maximize heat dissipation and to help prevent the heat from being re-absorbed by the base plate.
Finally, the ATS-03E-07-C2-R0 thermal - heat sinks feature a durable and stylish anodized aluminum finish. This finish provides enhanced corrosion resistance as well as a sleek and modern look for any application. Additionally, this heat sink design is designed with ease of installation in mind and comes with mounting hardware, making it easy to mount and secure in any system.
In conclusion, the ATS-03E-07-C2-R0 is a highly competent thermal - heat sink design that is perfect for any manufacturing and engineering environment. It is designed to effectively remove heat from electronic components and helps to keep temperatures low, allowing for maximum performance. Additionally, it features a durable and stylish anodized aluminum finish and comes with ease of installation in mind. All of these features make the ATS-03E-07-C2-R0 an ideal thermal - heat sink for any application.
The specific data is subject to PDF, and the above content is for reference