| Allicdata Part #: | ATS-03E-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-03E-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential for today\'s high-powered electronics. Heat generated by the electronic components must be effectively and efficiently dissipated to prevent the system from overheating and potential component failure. Heat sinks are one of the most common solutions used to manage the thermal interface between the component and its environment. The ATS-03E-10-C1-R0 is an active heat sink that uses advanced thermal management solutions to ensure efficient cooling and long-term component reliability. In this article, we will discuss the application field and working principle of the ATS-03E-10-C1-R0.
The ATS-03E-10-C1-R0 is a small, energy efficient active heat sink with a robust design that makes it ideal for use in a variety of applications, such as automotive, medical, and industrial electronics. This heat sink uses a combination of passive and active cooling methods to reduce the total amount of energy required to manage the thermal interface. It features an enclosed design with air channels that are specifically engineered to optimize airflow and maximum heat dissipation. Its compact size and lightweight construction make the ATS-03E-10-C1-R0 ideal for use in portable or limited space designs.
The working principle of the ATS-03E-10-C1-R0 involves using a diaphragm and small electric motor to move air through the heat sink. The electric motor is powered by a low voltage DC power supply and is used to drive the diaphragm which in turn creates an air flow through the heat sink. The air flow created by the diaphragm helps to improve the efficiency of the heat sink by providing increased air movement around the heat source. Along with the increased airflow, the ATS-03E-10-C1-R0 also uses fins to dissipate the heat away from the heat source. The heat dissipation is further enhanced by a combination of convection and radiation. The heat sink can also be combined with other cooling techniques, such as fans, to create a more efficient cooling system.
The ATS-03E-10-C1-R0 active heat sink is designed to provide a reliable, efficient, and cost effective cooling solution for a variety of applications. Its single-piece construction and lightweight design make it ideal for use in tight spaces. The diaphragm and electronic motor provide increased air flow and higher thermal efficiency than traditional heat sinks. The combination of features and design elements make the ATS-03E-10-C1-R0 an ideal choice for applications where thermal management is critical.
The specific data is subject to PDF, and the above content is for reference