ATS-03E-10-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS6610-ND

Manufacturer Part#:

ATS-03E-10-C2-R0

Price: $ 4.19
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03E-10-C2-R0 datasheetATS-03E-10-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.80520
10 +: $ 3.70125
25 +: $ 3.49574
50 +: $ 3.29011
100 +: $ 3.08448
250 +: $ 2.87885
500 +: $ 2.67322
1000 +: $ 2.62181
Stock 1000Can Ship Immediately
$ 4.19
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A thermal heat sink utilizes the process of dissipating heat in order to cool a device or system. Heat sinks are commonly found in computers, automotive engines, and even consumer electronics. The ATS-03E-10-C2-R0 takes a unique approach to thermal management that enables greater flexibility and innovation. This article will discuss the application field and working principle of the ATS-03E-10-C2-R0.

Application Field

The ATS-03E-10-C2-R0 is designed for use in various devices and systems, including but not limited to computers, automotive engines, consumer electronics, and industrial machines. It is capable of handling varying levels of heat dissipation, and due to its versatility and size, it is suitable for a range of applications. Additionally, its modular design allows users to customize their thermal management strategy.

Due to its unique design, the ATS-03E-10-C2-R0 is especially well-suited for use in smaller, confined spaces where traditional heat sinks are not feasible. This makes it perfect for applications such as laptop computers and other smaller consumer electronics, where space is at a premium. Additionally, its high levels of heat dissipation can be beneficial for many industrial applications, such as in manufacturing and industrial control systems.

Working Principle

The ATS-03E-10-C2-R0 works by dissipating heat away from devices or systems and into a larger area where it can be dissipated at a lower temperature. This is done by increasing the surface area that the heat can be dissipated from. This increases the area over which the heat can be dissipated, helping to keep the device or system cooler for longer.

The heat sink also works by utilizing a fan to further the cooling process. The fan helps to pull air across the surface of the heat sink to further improve the dissipation process. The fan is also capable of providing a direct airflow onto the surface of the heat sink, helping to further the cooling process.

Finally, the ATS-03E-10-C2-R0 also uses a finned radiator design. This design further increases the surface area for heat dissipation, as the fins help to trap more air and increase the area over which the heat can dissipate.

Conclusion

The ATS-03E-10-C2-R0 is a versatile thermal heat sink designed for use in a range of applications. It is able to provide users with greater flexibility and innovation in their thermal management strategies. Additionally, its use of a fan, finned radiator design, and efficient heat dissipation process makes it perfect for use in small, confined spaces, as well as in larger applications.

The specific data is subject to PDF, and the above content is for reference

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