| Allicdata Part #: | ATS-03E-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-03E-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-03E-116-C3-R0 is a type of thermal-heat sink and plays an important role in the process of dissipating heat away from various electronic components and devices. Heat sinks are generally designed to take most of the heat away from the components to the atmosphere. ATS-03E-116-C3-R0 has a special compound structure consisting of a polypropylene base and compound heat sinks. This advanced thermal solution is highly effective in dissipating heat from the components, and thereby making the use of electronic devices safe and reliable.
The ATS-03E-116-C3-R0 thermal-heat sink is an ideal choice for use in a variety of applications. It is particularly suitable for use in power electronic devices such as rectifiers, power supplies, converters, motors, inverters, and switches. This specific thermal-heat sink is also popular in a range of applications like Battery Charger/Discharger, Interconnect Systems, Networked Systems, Medical and Industrial Automation Systems, and Home Environment Control Systems.
The ATS-03E-116-C3-R0 thermal-heat sink works on the principle of thermal convection process and the use of a compound thermal compound. It features two deep channels that enable convection of hot air away from the components. The compound layers helps to contribute towards the heat dissipation process, further improving the performance of the thermal-heat sink. Furthermore, the specially designed material in the thermal-heat sink increases the surface area significantly, enhancing thermal performance and saving space.
The installation process of ATS-03E-116-C3-R0 is very simple and is mainly done by securing the spring clip on the heat sink. The heat sink should be attached onto the required positions of the component with pressure, and the procedure is completed with the help of mounting screws. In the process of installation or usage, special attention should be given to ensure that there is no contact between any part of the heat sink and the component, as direct contact between the two may cause damage.
In order to get the most out of this thermal-heat sink, the device should be installed in an environment with as little moisture and dust as possible. Additionally, the device should be regularly checked and cleaned with compressed air, and should be free from any accumulation of dirt or debris. Proper maintenance and upkeep can help to drastically improve the performance and reliability of this type of thermal-heat sink.
The ATS-03E-116-C3-R0 thermal-heat sink offers a highly efficient and reliable performance in a wide range of applications, thanks to its unique construction and advanced material selection. Its simple installation procedure further adds to its overall value, making it an ideal choice for various applications. Therefore, the ATS-03E-116-C3-R0 thermal-heat sink is sure to find extensive use in the electronic industry, helping to keep components safe and operational for longer periods of time.
The specific data is subject to PDF, and the above content is for reference