ATS-03E-142-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-03E-142-C2-R0 Application Field and Working Principle

Heat sinks are highly effective tools used for dissipating and removing heat from electronic components to keep them within optimal operating temperatures. Heat sinks work to increase the surface area of the component in contact with the air; this helps with the thermal dissipation process, which turns the waste heat energy into lower temperatures. The greater the surface area, the more heat can be transferred to the environment. They can also be used to limit the temperature gradients across the device, allowing it to function confidently and consistently.The ATS-03E-142-C2-R0 is an exceptionally high-performance heat sink. It is a finned aluminum heat sink assembly with an overall deformed shape, designed to give maximum thermal performance in a limited space. It also features a high-quality, durable aluminum construction and soldered connections for reliable heat dissipation. As far as Thermal solutions go, these heat sink assemblies can provide great performance, flexibility, and efficiency for a wide variety of applications, particularly in the consumer electronics and HVAC/R industries.When it comes to the application field of the ATS-03E-142-C2-R0, the system is best suited for thermal control and cooling tasks. As mentioned earlier, its form factor makes it ideal for use in small spaces and its aluminum construction provides excellent thermal dissipation properties. Additionally, the heat sink assembly can also be used to improve the overall efficiency of electronic equipment by amplifying the heat transfer process, allowing for better regulating of temperatures in these components.As far as the working principle goes, the ATS-03E-142-C2-R0 is primarily designed to move heat away from the component it is attached to. The contours of the heat sink allow for greater surface area contact with the air, thus increasing the amount of heat that can be dissipated. Additionally, the aluminum construction is designed to dissipate heat more quickly and with greater efficiency. This allows for optimal temperature regulation and performance in the component it is attached to. The system also provides efficient heat dissipation and excellent thermal regulation in a limited space.In conclusion, the ATS-03E-142-C2-R0 is a high-performance aluminum heat sink assembly designed for maximum thermal performance in a limited space. The component is best suited for use in the consumer electronics and HVAC/R industries, where it is able to improve system efficiency and regulate temperature trends. As far as the working principle goes, the heat sink assembly works to move heat away from the device through enhanced surface area contact and improved thermal heterogeneity, allowing for improved thermal regulation and performance.

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