| Allicdata Part #: | ATS-03E-159-C3-R0-ND |
| Manufacturer Part#: |
ATS-03E-159-C3-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-159-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are a type of passive cooling component that helps to dissipate heat from electronic components, preventing them from becoming too hot and emitting too much noise. ATS-03E-159-C3-R0 is a type of Thermal Heat Sink which is designed for particular types of electronic components.
This type of Thermal Heat Sink is particularly suitable for VHF/UHF power transistors. It is made of aluminum alloy and has a black anodized finish. Its shape is designed to maximize heat dissipation, and its design ensures that it will fit the desired components. The total size of ATS-03E-159-C3-R0 is 15.9 x 10.7 x 3.0 cm, with a black anodized finish.
ATS-03E-159-C3-R0 is designed to provide a better scope for more efficient heat dissipation. This Thermal Heat Sink is made of a special aluminum alloy that is highly conductive and has good thermal properties. Due to the special design, this Thermal Heat Sink has a more direct contact with the components, allowing for maximum efficiency in heat dissipation.
In order to maintain maximum efficiency of the Thermal Heat Sink, the contact surface should be polished twice a year with sandpaper (grain 120) and then further treated with an appropriate motor oil. This will help to prevent damage to the aluminum surface and ensure long lasting performance of the device.
The working principle of ATS-03E-159-C3-R0 is simple. The Thermal Heat Sink has a base part, which acts as a heat sink. This is attached to the component that needs cooling. The surface area of the heat sink is greater than that of the component, allowing for a greater exchange of heat between the two parts. Heat is dissipated from the electronic components to the base part of the Thermal Heat Sink, where it is then released to the surrounding environment.
ATS-03E-159-C3-R0 is designed for superior performance and is very reliable. It is highly durable and resistant to corrosion and damage. Furthermore, it is lightweight and easy to install on most types of components. The application fields of this Thermal Heat Sink are mainly for VHF/UHF power transistors.
In conclusion, ATS-03E-159-C3-R0 is a reliable and efficient Thermal Heat Sink designed for VHF/UHF power transistors. It is robust, durable and offers superior performance in terms of thermal dissipation. It is lightweight and easy to install and should be polished twice a year with sandpaper and oil for optimum performance. Its working principle is simple and effective, allowing for maximum efficiency in heat dissipation.
The specific data is subject to PDF, and the above content is for reference