| Allicdata Part #: | ATS6679-ND |
| Manufacturer Part#: |
ATS-03E-162-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-162-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are widely used in a variety of applications. One of the most popular types of thermal management solutions is the ATS-03E-162-C2-R0. This heat sink system provides a great combination of efficiency and reliability, and can be used in a variety of circumstances.
The ATS-03E-162-C2-R0 heat sink consists of a base constructed of either aluminum (often copper) or stainless steel. The base is specially designed to provide maximum airflow and help transfer heat away from the heat sink fins. These base plates are also typically designed with various pinholes or slots to provide additional air circulation. On top of these base plates are the fins, which are made of a variety of materials such as aluminum, copper, or stainless steel. The fins are designed to provide additional cooling, as the air passing over them will help disperse heat away from the heat sink system.
The working principle of the ATS-03E-162-C2-R0 heat sink system is based on a process known as thermodynamics. In this process, the heat from the object (typically a processor or other electronic component) is absorbed by the heat sink and then transferred to the environment. As the heat is transferred, it is converted into thermal energy, which dissipates into the surrounding air. This process ensures that the heat generated by the component is safely removed before it can cause system malfunctions.
Overall, the ATS-03E-162-C2-R0 heat sink is a great option for a variety of cooling applications. It has a robust design that is proven to be highly efficient and reliable. Its large base plate and optimized fin design allow for excellent heat transfer, which helps ensure that the system runs at optimal temperatures. Furthermore, the thermodynamics-based working principle of the heat sink helps ensure that all of the heat generated by the component is effectively removed to prevent system malfunctions.
Heat sinks such as the ATS-03E-162-C2-R0 can be found in the following application fields:
- Desktop computers
- Laptop computers
- Mobile phones
- Video cards
- Electronic circuits
- Power supply systems
- Motor controllers
- Thermal management systems
- High-performance computing systems
- Industrial systems
- Medical systems
- Automotive systems
- Test and measurement systems
The ATS-03E-162-C2-R0 heat sink can also be used in many other applications, as it is designed to be highly reliable and efficient. In addition to its excellent thermal properties, it also offers a cost-effective solution. It is also easy to install and maintain, allowing users to quickly and easily improve their system\'s thermal management.
The specific data is subject to PDF, and the above content is for reference