| Allicdata Part #: | ATS6685-ND |
| Manufacturer Part#: |
ATS-03E-168-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-168-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.01°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sink is a device that is used to ensure that electronic components are kept cool when they become too hot during operation. The Thermal - Heat Sink ATS-03E-168-C2-R0 is a specific type of heat sink designed for use with certain electronic components. This particular heat sink is specifically designed for use with circuits and components that have an operating current of up to 168 amperes. The design of this heat sink also allows for a reduction in temperatures of up to 30 degrees Celsius when used in conjunction with other cooling methods.
The Thermal-Heat Sink ATS-03E-168-C2-R0 is made up of several components that work together to dissipate heat. At the center of the heat sink assembly is a pin fin base. This base is made from aluminum that has been machined and shaped into fins. The base is then coated in a copper-like material that helps to increase its heat transfer ability. A heatspreader layer is then attached to the pin fin base which helps to spread the heat evenly throughout the heat sink and reduce the amount of heat that is concentrated in a single area.
In addition to the pin fin base and heatspreader layer, the Thermal-Heat Sink ATS-03E-168-C2-R0 also has a fan attached to its underside. This fan helps to circulate the air within the heat sink and ensure that the heat is distributed evenly throughout. The fan is powered by a standard electrical outlet and helps to pull the air from inside the computer case and draw it onto the heatsink where it is then dispersed into the surrounding environment.
The Thermal-Heat Sink ATS-03E-168-C2-R0 also includes a thermal pad that sits between the heatsink and the component that it is cooling. This pad is made of special material that helps to absorb some of the heat and transfer it away from the component to the heatsink. This helps to prevent the component from overheating and reduces the chance of damage. The thermal pad is also designed to prevent corrosion from occurring on the component.
Overall, the Thermal-Heat Sink ATS-03E-168-C2-R0 is an effective and efficient heat sink that is designed to keep electronic components cool and running at optimal levels. The pin fin base has excellent heat transfer abilities, the heatspreader layer helps to evenly disperse the heat, and the fan helps to circulate the air inside the heatsink and remove any hot spots. The thermal pad also helps to absorb and transfer the heat away from the component and helps to prevent any corrosion from occurring. All of these features work together to make the Thermal-Heat Sink ATS-03E-168-C2-R0 a great choice for cooling a wide range of electronic components.
The specific data is subject to PDF, and the above content is for reference