| Allicdata Part #: | ATS-03E-169-C1-R0-ND |
| Manufacturer Part#: |
ATS-03E-169-C1-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-169-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03E-169-C1-R0 is a Thermal - Heat Sink, which provides cooling to electronic components such as microprocessors, transistors and other highly sensitive devices which can be damaged due to overheating. The ATS-03E-169-C1-R0 works by dissipating heat away from the component to be cooled. This is achieved through a process of conduction and convection, with the conduction stage happening when the heat is transferred from the component to a metal element within the heat sink. The convection stage is then used to transfer the heat away from the sink towards the atmosphere. The ATS-03E-169-C1-R0 can be used in a variety of applications, including but not limited to: medical and industrial equipment, aviation, automotive, military, and even consumer electronics.
The ATS-03E-169-C1-R0 consists of an aluminium base which is highly thermally conductive, an extruded heat sink body and integrated fans which are used to increase the air flow across the heat sink surface. The metal piece that is used for heat transfer into the heat sink body can be made of copper or aluminium, depending on the requirements of the application. The fans provide a significant portion of the cooling effect - by drawing air away from the heat sink, while helping to push air into the heat sink and out of the system. Additionally, the entire structure is designed in such a way that air can easily flow over the surfaces of the heat sink, further increasing the amount of heat that can be dissipated away.
The ATS-03E-169-C1-R0 is an effective and reliable method of helping to keep electronic components in functioning condition, even in high-stress circumstances. By providing increased cooling capabilities, the ATS-03E-169-C1-R0 helps to ensure that components are able to work at their optimal functionality in even the most extreme environments. The fan design also helps to support the cooling process, providing a higher degree of power efficiency by allowing more air to flow over the heat sink surface, bringing in more fresh air while pushing out the hot air.
The ATS-03E-169-C1-R0 is a highly efficient and reliable cooling solution for a range of applications. Its use of an aluminium base provides strong thermal conductivity capabilities, while its use of fans ensures that an increased level of air is moving over the heat sink’s surface. Furthermore, its efficient design ensures that the highest level of cooling efficiency is achieved, while its overall size helps to reduce the amount of space that is taken up in many electronics. Ultimately, the ATS-03E-169-C1-R0 is able to provide a high level of thermal protection and performance for many of the most demanding applications on the market.
The specific data is subject to PDF, and the above content is for reference