| Allicdata Part #: | ATS6688-ND |
| Manufacturer Part#: |
ATS-03E-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are highly efficient ways to dissipate energy away from hot spots and protect sensitive components on a circuit. Heat sinks are typically made of metal, like aluminum, copper, and brass. The purpose of a heat sink is to disperse the heat from the component that it is attached to, allowing it to cool more efficiently. Heat sinks are used primarily in electronic and computer systems, to keep components from becoming too hot and ultimately damage the components. The ATS-03E-170-C2-R0 is one such heat sink.
The ATS-03E-170-C2-R0 is a smaller sized heat sink designed for use in tight spaces and in smaller applications. It has an integrated mounting system that allows for quick and easy installation. The heat sink itself features an extruded aluminum body and fins that are designed for maximum heat transfer and minimum weight. The fins are designed to be closely spaced, allowing for maximum heat conduction and dissipation. The size of the heat sink is 170mm in length, 80mm in width, and 20mm in height. The center of gravity is placed in the middle of the heat sink, ensuring that when mounted, the device will be balanced and evenly distributed.
The ATS-03E-170-C2-R0 offers a number of important benefits. These include excellent thermal performance, good heat dissipation, and a lightweight design that allows for easy installation. The device is also compatible with an array of specialty heat sinks, allowing for a custom fit for any application. The heat sink is also designed to have the minimal required spacing between components, providing a reliable design that can handle the toughest conditions and harsh environments.
The working principle of the ATS-03E-170-C2-R0 is quite simple. When the device is exposed to a heat source, the heat is transferred through the metal fins and into the air. As the air cools the fins, the heat dissipates and leaves the device relatively cooler. This allows for the device to maintain a safe operating temperature, which is essential for any application. In addition to dissipating the heat, the fins also serve to suspend the device, allowing for improved aerodynamics, increased airflow, and better circulation.
The ATS-03E-170-C2-R0 is an excellent choice for any application where heat dissipation is a primary concern. It is suitable for a wide range of applications, including small form factor systems, embedded systems, microprocessors, and memory modules. The heat sink is designed to be compact, lightweight, and provide superior thermal performance. It is a great choice for applications requiring efficient thermal management and reliable performance.
The specific data is subject to PDF, and the above content is for reference