| Allicdata Part #: | ATS-03E-188-C3-R0-ND |
| Manufacturer Part#: |
ATS-03E-188-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-188-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are widely used in the cooling of modern electronic components due to their ability to dissipate heat away from hot spots at a higher rate than air cooling alone and are available in a variety of shapes and sizes. The ATS-03E-188-C3-R0 is a specific type of thermal heat sink designed primarily for use in the cooling of high power components such as power transistors, voltage regulators, and energy devices.
The ATS-03E-188-C3-R0 heat sink is comprised of a Copper-Alloy Base and Copper-Alloy Tops which communicate with a vast array of cooling fins radiating away heat from the heat source. The Copper-Alloy material has been machined to a T-slot allowing for the insertion of a thermal interface between the component and the heat sink. It also features a low resistance contact surface, high thermal conductivity and a low overall weight. The top base is welded together with a flexible hose connection to the back plate allowing for easy installation and integration into the current cooling system.
In terms of application, the ATS-03E-188-C3-R0 has been designed to provide superior heat dissipation in a variety of high power applications, such as: high power transistors, DC/DC converters, voltage regulators, and energy devices. It has been successfully used in a variety of applications, such as telecommunication, industrial and automotive applications where high power components require short development times and high reliable performance.
The ATS-03E-188-C3-R0 is a very efficient thermal heat sink and as such, it is popularly utilized as a way to reduce the overall thermal resistance in a given application. Its design incorporates a number of features designed to maximize heat dissipation. For example, the use of copper-alloy materials which conduct heat away from the heat source helps keep temperatures down. The utilization of a low resistance contact surface also helps decrease the overall thermal resistance between the component and the heat sink. Lastly, the use of a flexible hose connection allows for easy installation and integration into the existing cooling system.
The ATS-03E-188-C3-R0 has a unique working principle which helps it provide superior thermal and electrical performance. It consists of a combination of copper-alloy base and copper-alloy tops which communicate with a variety of cooling fins radiating heat away from the component. The inclusion of copper-alloy material helps the heat sink dissipate heat more effectively throughout its surface area. Additionally, its low thermal resistance helps reduce the overall temperature of the device being cooled by a significant amount.
The ATS-03E-188-C3-R0 is an excellent example of a thermal heat sink for high power components. It features a combination of features designed to increase thermal performance, including copper-alloy material which is machined to a T-slot to allow for the insertion of a thermal interface and a low resistance contact surface. Additionally, it features a low overall weight and flexible hose connection for easy installation and integration into an existing cooling system. It is designed to be used in a variety of applications, including high power transistors, DC/DC converters, voltage regulators, and energy devices, where high thermal performance and reliability are required.
The specific data is subject to PDF, and the above content is for reference