| Allicdata Part #: | ATS6710-ND |
| Manufacturer Part#: |
ATS-03E-190-C2-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-190-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.37220 |
| 10 +: | $ 4.25628 |
| 25 +: | $ 4.02016 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03E-190-C2-R0 heat sink is a part of the ATS range of heat sinks designed by ACT Thermal Systems. They are specifically designed for cooling surface mount electronic components such as surface mounted microprocessors and transistors. This particular model is also suitable for thick film and IC applications, particularly for frequencies up to 1GHz. It can also handle high power electronic components such as transistors and LEDs.
The ATS-03E-190-C2-R0 heat sink is a two-piece unit, with one part being a metal base and the other being a removable lid. The base is made of aluminium for superior heat dissipation, while the lid is made of a thermal flux dissipator. The heat sink also features a thermal adhesive, reducing the need for extra hardware. The thermal adhesive is also removable, meaning that components can easily be changed in the future.
The ATS-03E-190-C2-R0 has a thermal resistance of less than 0.25°C/W. This means that it can dissipate up to 190 Watts of heat. It also features a high-speed heat conduction design that guarantees optimal heat dissipation. The unit\'s design also ensures that the heat dissipates quickly, which reduces thermal stress on the components.
The ATS-03E-190-C2-R0 heat sink\'s working principle is based on convective cooling. This happens when the heat sink absorbs heat from the component and then dissipates it to the surrounding air. The heat sink also allows air to flow freely around the components, which helps to reduce thermal stress.
The ATS-03E-190-C2-R0 heat sink is designed for use in a variety of electronic components and is particularly suited to those with high power demands. It is also compatible with a range of PCBs, making it an ideal choice for most applications. Additionally, the components are designed to meet the stringent requirements of the RoHS directive which restricts the presence of certain hazardous substances in electronic products.
The ATS-03E-190-C2-R0 heat sink is a great choice for cooling surface mounted electronic components such as microprocessors and transistors. With its superior heat dissipation, high-speed heat conduction design and thermal adhesive, it ensures that components stay cool even with the highest power demands. This makes it a great choice for a range of different applications and a reliable option for ensuring the long-term reliability of any system.
The specific data is subject to PDF, and the above content is for reference