ATS-03E-195-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.12°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-03E-195-C3-R0 is a thermal – heat sink designed for a wide range of applications. ATS-03E-195-C3-R0 is a lightweight and compact heat sink made from aluminum and copper that offers superior thermal transfer and excellent ability to dissipate and absorb heat. The ATS-03E-195-C3-R0 is designed to be used in applications such as commercial, medical, automotive, military, computer and industrial.

Application Field and Working Principle

ATS-03E-195-C3-R0 thermal – heat sink can be used in a variety of applications where thermal management and heat transfer are the primary concern. The ATS-03E-195-C3-R0 has excellent heat transfer properties that make it a cost effective solution for applications that require cooling. The efficient heat transfer is achieved by using a combination of aluminum and copper, which provide excellent thermal conductivity and can absorb significant amounts of heat. Due to the excellent heat transfer properties of the ATS-03E-195-C3-R0 heat sink, it can effectively dissipate and transfer thermal energy from one component to another. The thermal energy is absorbed by the fins and then quickly dissipated to the air as heat. By providing an efficient path for heat to be dissipated, the ATS-03E-195-C3-R0 can improve the performance and lifespan of a heat-generating component, such as a PC processor or GPU. The ATS-03E-195-C3-R0 heat sink also has several features that make it an ideal choice for applications that require cooling. Its lightweight construction allows it to be mounted in tight spaces, and its excellent thermal performance enables it to dissipate heat faster than other thermal solutions. Additionally, its advanced fin design provides a large surface area for heat dissipation, which increases its overall efficiency. Furthermore, the design of the ATS-03E-195-C3-R0 enables it to be easily configured to fit a wide range of mounting options. This flexibility allows the heat sink to be used in applications with diverse size requirements and/or installations in tight spaces. Additionally, the ATS-03E-195-C3-R0 can be used in applications with high levels of heat, such as in high performance electrical enclosures or systems that require a significant amount of cooling. In summary, the ATS-03E-195-C3-R0 thermal – heat sink is a cost effective and reliable solution for applications that require thermal management and heat transfer. Its excellent heat transfer properties, lightweight construction, and versatile mounting options make it an excellent choice for a wide range of applications. Additionally, its advanced fin design allows it to efficiently dissipate heat quickly and effectively, ensuring the reliability of the system.

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