ATS-03E-209-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS6730-ND

Manufacturer Part#:

ATS-03E-209-C2-R0

Price: $ 6.82
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03E-209-C2-R0 datasheetATS-03E-209-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 6.13620
10 +: $ 5.96862
25 +: $ 5.63699
50 +: $ 5.30536
100 +: $ 4.97372
250 +: $ 4.64214
500 +: $ 4.31056
1000 +: $ 4.22766
Stock 1000Can Ship Immediately
$ 6.82
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.27°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a complex field that requires a variety of products and services to keep electronic components and systems working efficiently. Heat Sinks are one of the most important components in the thermal management of any system, as they help regulate the temperature and help keep the system operational. The ATS-03E-209-C2-R0 Heat Sink is a versatile thermal solution designed to address the needs of commercial and industrial applications by providing high-performance cooling, a low profile design, and maximum heat dissipation.

This Heat Sink features an aluminum housing, which is a common material choice for many heat sink applications due to its ability to dissipate heat quickly and efficiently. This model is configured with a finned heat sink design, which is a common and effective heat transfer method in Heat Sinks. This design provides optimal thermal management, as the fins allow for air to flow more easily over the surface of the Heat Sink, which in turn provides better cooling. The ATS-03E-209-C2-R0 Heat Sink also features a clip mounting feature, which ensures a secure and easy installation without the need for additional mounting hardware.

The ATS-03E-209-C2-R0 Heat Sink is designed primarily for commercial and industrial applications, such as computers, servers, and other electronic components. In these types of applications, the Heat Sink works by channeling heat away from the components it is cooling. This is done by the fins of the Heat Sink, which increase the exposed surface area, thus allowing for more efficient heat transfer. As the Heat Sink works to move the heat away from the component, the air around it is able to pull away the heat which is subsequently expelled from the system.

The ATS-03E-209-C2-R0 Heat Sink is a thermally efficient solution with a low profile design and easy installation process. This makes it an ideal choice for many electronic components and systems, providing effective cooling and heat dissipation, making it a reliable and cost-effective option for thermal management. As a versatile solution, it is suitable for a variety of applications, such as computers, servers, and other electronic components.

The specific data is subject to PDF, and the above content is for reference

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