ATS-03E-21-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03E-21-C1-R0-ND

Manufacturer Part#:

ATS-03E-21-C1-R0

Price: $ 4.14
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03E-21-C1-R0 datasheetATS-03E-21-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.75921
30 +: $ 3.55047
50 +: $ 3.34152
100 +: $ 3.13267
250 +: $ 2.92383
500 +: $ 2.71499
1000 +: $ 2.66278
Stock 1000Can Ship Immediately
$ 4.14
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.26°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a growing area in the electronics industry. As electronic components and systems become more complex and powerful, they generate more heat than ever before. Thermal management is the process of controlling and regulating heat in order to reduce risk and increase component and system performance. The ATS-03E-21-C1-R0 is a CPU heatsink designed for use in high-end electronic and computing systems. It is a high performance heatsink that is designed to dissipate the high temperatures generated by powerful processors. In this article, we will provide an overview of the application field and working principle of the ATS-03E-21-C1-R0 thermal-heat sink.

Application

The ATS-03E-21-C1-R0 is designed for use in high-end desktop computing systems, servers, and other devices that generate high levels of heat. The heatsink is designed to dissipate the heat generated by powerful CPUs to prevent the components and systems from overheating. It is also designed with a series of fins that increase the surface area of the heatsink, allowing it to dissipate more heat. The ATS-03E-21-C1-R0 is compatible with Intel and AMD chipsets, making it ideal for a wide range of systems.

Working Principle

The ATS-03E-21-C1-R0 uses a combination of passive and active cooling techniques to keep the temperature of the processor within acceptable levels. The heatsink draws in air from the surrounding environment and uses a fan to blow it over the heatsink. This air dissipates the heat from the processor to the surrounding environment, cooling the processor. The heatsink also has a series of fins which increase the surface area of the heatsink. This increases the amount of heat that can be dissipated, allowing the processor to operate cooler.

The fan also speeds up and slows down depending on the temperature of the processor. If the processor reaches a certain temperature, the fan will increase its speed to cool it down. Similarly, if the processor reaches a certain temperature, the fan will slow down to avoid overcooling the processor.

The ATS-03E-21-C1-R0 is a high-performance heatsink that is designed to control and regulate the temperature of a processor. It is an effective solution for cooling powerful processors that generate a lot of heat. Its combination of passive and active cooling techniques ensures that the processor is kept within a safe temperature range, allowing it to operate at maximum efficiency.

The specific data is subject to PDF, and the above content is for reference

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