| Allicdata Part #: | ATS-03E-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-03E-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-03E-25-C1-R0 thermal heatsinks are designed for a variety of applications. They are suitable for any type of electronic equipment, especially those with complex thermal requirements. The heatsink is designed with a combination of fins and pins to provide efficient heat dissipation and uniform airflow over the components. The combination of pins and fins also increases the thermal contact area, resulting in improved cooling performance. The heatsink also features an anodized aluminum construction which provides superior strength and corrosion resistance.
The heatsink is designed to provide effective heat transfer from an electronic component to the surrounding environment. It works by conducting heat from the electronic component and dissipating it to the atmosphere. Heat is transferred from the component through the heatsink material and onto the fins or pins. The fins provide a large surface area for heat transfer and rapidly transfer the heat away from the component. The pins increase the thermal contact area which allows the heat to flow away from the component more quickly. The heat is then dissipated into the atmosphere through the fins and/or pins.
The heatsink is typically installed on top of the electronic component. This improves thermal contact between the component and the heatsink. The increased contact area allows heat to be conducted more efficiently from the component to the heatsink. The heatsink is typically mounted on top of the component with screws, so that the component is secured and makes better contact with the heatsink. Additionally, the screws can help reinforce the connection between the heatsink and the component.
ATS-03E-25-C1-R0 thermal heatsink is designed to handle most types of thermal demand. The heatsink is designed for use in applications where it is required to dissipate excess heat generated by the equipment. This heat removal is essential as it can help prevent heat-related damage or failure. The thermal heatsink is also designed for use in noise reduction applications. The fins and pins act as sound barriers, reducing the amount of noise generated by the component.
In summary, the ATS-03E-25-C1-R0 thermal heatsink is designed for a variety of applications. It features an anodized aluminum construction for superior strength and corrosion resistance. The combination of pins and fins increases the thermal conductivity of the component and provides an efficient heat dissipation solution. The heatsink is also suited for noise reduction applications, as it acts as a sound barrier. Overall, the ATS-03E-25-C1-R0 thermal heatsink provides an effective and reliable heat transfer and cooling solution for a variety of electronic components.
The specific data is subject to PDF, and the above content is for reference