| Allicdata Part #: | ATS-03E-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-03E-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices used to transfer thermal energy from one object to another and dissipate it into the environment. ATS-03E-36-C1-R0 is a type of heat sink specifically designed for large, high-temperature applications. This particular model has a heatsink consisting of copper fins to allow for efficient heat transfer and is ideal for applications requiring long dissipation times.
The ATS-03E-36-C1-R0 is designed for use in areas where high temperatures above 40°C are experienced. Its copper fins are arranged in a fin-shaped design with four rows of five fins which provide a larger surface area. This allows the heat generated in the application to be transferred to the surrounding air quickly, thus providing a high-efficiency system.
In order to operate the ATS-03E-36-C1-R0 heatsink, the user must use an appropriate thermal interface material such as a thermal pad, thermal paste, or thermal adhesive. This thermal interface material serves as a medium that allows heat to pass from the component to the heatsink, increasing the efficiency of the system and allowing for better thermal management. The thermal interface material should be correctly applied and the heatsink securely mounted to the component to ensure proper operation.
The ATS-03E-36-C1-R0 is capable of handling heat loads of up to 36W and has a thermal resistance of 0.4°C/W. This makes it perfect for cooling high-power components such as microprocessors, power electronics, and high-power resistors. It is also suitable for applications that require long dissipation times such as laser systems and ovens.
The ATS-03E-36-C1-R0 can be used in a variety of applications and is ideal for large, high-temperature applications such as large electronics components. Its highly efficient heat transfer properties and long dissipation times make it an ideal choice for many applications. The ATS-03E-36-C1-R0 is an excellent option for thermal management in these types of applications.
The specific data is subject to PDF, and the above content is for reference